(A) study on the ultra fine pitch Chip-On-Plastic (COP) packaging using nanofiber Anisotropic Conductive Films (ACFs)

Abstract

In anisotropic conductive films (ACFs) technology, nanofier ACFs which are advanced ACFs type were introduced to control the limitation at ultra fine pitch packaging. The aim of this study was to optimize the nanofiber ACFs for chip on plastic (COP) packaging and to characterize the COP packaging interconnection. Nanofiber ACFs were fabricated by lamination of anion curing mechanism epoxy resin and PBS, PVDF nanofibers incorporating conductive particles. Nanofiber ACFs comparing with conventional ACFs increased the capture rate of conductive particles from 28 % to over 60 %. Humidity standing ability of nanofiber ACFs was analyzed by 85 ℃ / 85 % RH reliability test. This indicates that in flexible plastic substrate, nanofiber ACFs can stably suppress conductive particle movement and control problems in ultra fine pitch packaging.