학위논문(석사) - 한국과학기술원 : 신소재공학과, 2017.2,[v, 78 p. :]
High-Speed Bonding; Semiconductor Packaging; Non-Conductive Film; TSV; Hybrid-Bump; 고속 본딩; 반도체 패키징; 비전도성 필름; 하이브리드 범프
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