Apparatus for and method of bonding nano-tip using electrochemical etching전해에칭을 이용한 나노팁의 접착장치 및방법

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Disclosed herein are an apparatus for and a method of bonding a nano-tip using electrochemical etching, in which a good bonding stability can be provided. The nano-tip bonding apparatus comprises a glass plate having a top surface of a certain desired area. An electrolytic solution having conductivity is placed on the top surface of the glass plate by means of surface tension. Means for moving reciprocally a base material having conductivity in opposite direction is provided. A carbon nano-tube is adhered to a pointed tip of the base material by means of an adhesive. An end portion of the carbon nano-tube is to be immersed in the electrolytic solution. A power supply is provided for applying an electric power to the electrolytic solution and the base material.
Assignee
KAIST
Country
US (United States)
Issue Date
2008-11-18
Application Date
2005-05-26
Application Number
11138772
Registration Date
2008-11-18
Registration Number
7452435
URI
http://hdl.handle.net/10203/233613
Appears in Collection
ME-Patent(특허)
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