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Showing results 1 to 12 of 12

1
Anisotropic conductive adhesives for thermo-compression bonding containing solder conductive particles and flux additives and method of connecting electronic parts using the same

Paik, Kyung-Wook; Park, Jae-Hyeong

2
Anisotropic Conductive Film and Method of Fabricating the same for Ultra-Fine Pitch COG Application

Paik, Kyung-Wook; Yim, Myung-Jin, 2003-04-04

3
Bildsensormodul und Verfahren zu seiner Herstellung

Paik, Kyung-Wook; Yim, Myung-Jin; Son, Ho-Young; Kwon, Yong-Min

4
Method for bonding between electrical devices using ultrasonic vibration

Paik, Kyung-Wook; Yim, Myung-jin; Kim, Hyoung-joon; Lee, Ki-won

5
Method for fabricating chip size packages using lamination process

Paik, Kyung-Wook; Jang, Se Young

6
Method for forming flip chip bump and UBM for high speed copper interconnect chip using electroless plating method

Paik, Kyung-Wook; Nah, Jae Woong; Jeon, Young Doo; Yim, Myung Jin

7
Method for manufacturing conductive adhesive for high frequency flip chip package applications

Paik, Kyung-Wook; Yim, Myung jin; Kwon, Woon Seong

8
Method for packaging flexible device using holding wafer, and flexible device manufactured by the same

Paik, Kyung-Wook; Lee, Keon Jae; Hwang, Geon Tae; Yoo, Hyeon Kyun; Kim, Do Hyun; Kim, Yoo Sun, 2019-01-01

9
Method of manufacturing anisotropic conductive film using vertical ultrasonic waves

Paik, Kyung-Wook; Yoon, DalJin; Lee, SangHoon

10
Method of manufacturing organic substrate with embedded active chip

Paik, Kyung-Wook; Son, Ho-Young

11
Self-exposure method for surface of conductive particles anchored in polymer layer, method of fabricating anisotropic conductive film using the self-exposure method and the anisotropic conductive film

Paik, Kyung-Wook; Yoon, Dal Jin

12
나노 섬유를 이용한 도전성 폴리머-접착제 및 그 제조 방법

Paik, Kyung-Wook; Suk, Kyoung, 2014-03-14

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