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College of Engineering(공과대학)School of Electrical Engineering(전기및전자공학부)EE-Conference Papers(학술회의논문)

Crosstalk Included Eye Diagram Estimation of High-speed and Wide I/O Interposer Channel for 2.5D / 3D IC

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Kim, Joung-Horesearcher / Choi,Sumin / Kim,Heegon / Kim,Kiyeong / Jung,Daniel H / Kim,jonghoon / Lim,Jaemin / Lee,Hyunsuk / Kim,Hyungsoo / Kim,yongju / Kim,Yunsing
Publisher
23rd Conference on Electrical Performance of Electronic Packaging and Systems
Issue Date
2014-10-25
Language
English
Citation

23rd Conference on Electrical Performance of Electronic Packaging and Systems

URI
http://hdl.handle.net/10203/226070
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EE-Conference Papers(학술회의논문)
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