A Study on the Cu-rod Anisotropic Conductive Films (ACFs) for Flex-on-Fabric (FOF) Interconnections using an Ultrasonic Bonding MethodA Study on the Cu-rod Anisotropic Conductive Films (ACFs) for Flex-on-Fabric (FOF) Interconnections using an Ultrasonic Bonding Method
In this study, effects of copper-rod ACFs on electrical joint properties of flex-on-fabric (FOF) will be investigated. Cu-rod ACFs with various Cu rod lengths were prepared, and then flexible printed circuits (FPCs) were bonded on conductive fabrics using Cu-rod ACFs with an ultrasonic bonding method. First, base resin of ACFs was optimized in terms of mechanical adhesion between conductive, porous fabrics and FPCs. Also, the effects of copper rod lengths on electrical joint properties were investigated. After ultrasonic bonding, conductive Cu rods were well captured in between conductive fabrics and metal electrodes of FPCs resulting in lower contact resistance than that of conventional ACFs with sphere conductive particles.
- Issue Date
- 2016-06-01
- Language
- English
- Citation
IEEE 66th Electronic Components and Technology Conference, pp.2245 - 2250
- Appears in Collection
- MS-Conference Papers(학술회의논문)
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