Ultra-Thin Chip-in-Flex (CIF) technology using Anisotropic Conductive Films (ACFs) for Wearable Electronics Applications

Cited 0 time in webofscience Cited 0 time in scopus
  • Hit : 148
  • Download : 0
DC FieldValueLanguage
dc.contributor.authorKim, Ji Hyeko
dc.contributor.authorLee, Tae-Ikko
dc.contributor.authorShin, Ji Wonko
dc.contributor.authorKim, Taek-Sooko
dc.contributor.authorPaik, Kyung Wookko
dc.date.accessioned2016-04-18T05:50:18Z-
dc.date.available2016-04-18T05:50:18Z-
dc.date.created2015-11-26-
dc.date.issued2015-10-15-
dc.identifier.citationThe 14th International Symposium on Microelectronics and Packaging-
dc.identifier.urihttp://hdl.handle.net/10203/204768-
dc.languageEnglish-
dc.publisherThe Korean Microelectronics and Packaging Society-
dc.titleUltra-Thin Chip-in-Flex (CIF) technology using Anisotropic Conductive Films (ACFs) for Wearable Electronics Applications-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.publicationnameThe 14th International Symposium on Microelectronics and Packaging-
dc.identifier.conferencecountryKO-
dc.identifier.conferencelocationKINTEX Hall2, Ilsan-
dc.contributor.localauthorKim, Taek-Soo-
dc.contributor.localauthorPaik, Kyung Wook-
dc.contributor.nonIdAuthorKim, Ji Hye-
dc.contributor.nonIdAuthorShin, Ji Won-
Appears in Collection
ME-Conference Papers(학술회의논문)MS-Conference Papers(학술회의논문)
Files in This Item
There are no files associated with this item.

qr_code

  • mendeley

    citeulike


rss_1.0 rss_2.0 atom_1.0