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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

Tensile Testing of Submicron Thick Free-standing Metal Thin Films without Etching Process

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dc.contributor.authorSeo, Jeong Minko
dc.contributor.authorJo, Woo Sungko
dc.contributor.authorLee, Sang Minko
dc.contributor.authorKim, Taek Sooko
dc.date.accessioned2016-04-18T05:46:49Z-
dc.date.available2016-04-18T05:46:49Z-
dc.date.created2015-12-15-
dc.date.issued2015-11-25-
dc.identifier.citationThe 3rd International Conference on Materials and Reliability-
dc.identifier.urihttp://hdl.handle.net/10203/204730-
dc.languageEnglish-
dc.publisherICMR-
dc.titleTensile Testing of Submicron Thick Free-standing Metal Thin Films without Etching Process-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.publicationnameThe 3rd International Conference on Materials and Reliability-
dc.identifier.conferencecountryKO-
dc.identifier.conferencelocationRamada Plaza Jeju Hotel-
dc.contributor.localauthorKim, Taek Soo-
dc.contributor.nonIdAuthorJo, Woo Sung-
dc.contributor.nonIdAuthorLee, Sang Min-
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ME-Conference Papers(학술회의논문)
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