DC Field | Value | Language |
---|---|---|
dc.contributor.author | Seo, Jeong Min | ko |
dc.contributor.author | Jo, Woo Sung | ko |
dc.contributor.author | Lee, Sang Min | ko |
dc.contributor.author | Kim, Taek Soo | ko |
dc.date.accessioned | 2016-04-18T05:46:49Z | - |
dc.date.available | 2016-04-18T05:46:49Z | - |
dc.date.created | 2015-12-15 | - |
dc.date.issued | 2015-11-25 | - |
dc.identifier.citation | The 3rd International Conference on Materials and Reliability | - |
dc.identifier.uri | http://hdl.handle.net/10203/204730 | - |
dc.language | English | - |
dc.publisher | ICMR | - |
dc.title | Tensile Testing of Submicron Thick Free-standing Metal Thin Films without Etching Process | - |
dc.type | Conference | - |
dc.type.rims | CONF | - |
dc.citation.publicationname | The 3rd International Conference on Materials and Reliability | - |
dc.identifier.conferencecountry | KO | - |
dc.identifier.conferencelocation | Ramada Plaza Jeju Hotel | - |
dc.contributor.localauthor | Kim, Taek Soo | - |
dc.contributor.nonIdAuthor | Jo, Woo Sung | - |
dc.contributor.nonIdAuthor | Lee, Sang Min | - |
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