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A novel synthesis method for designing Electromagnetic Band Gap (EBG) structures in packaged mixed signal systems Kim T.H.; Chung D.; Engin E.; Yun W.; Toyota Y.; Swaminathan M., IEEE 56th Electronic Components and Technology Conference, pp.1645 - 1651, 2006-05-30 |
Effect of wafer level packaging, silicon substrate and board material on gigabit board-silicon-board data transmission Kim W.; Madhavan R.; Mao J.; Choi J.; Choi S.; Ravi D.; Sundaram V.; et al, 2004 Proceedings - 54th Electronic Components and Technology Conference, v.2, pp.1506 - 1512, 2004-06-01 |
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