DSpace at KOASAS: Effect of wafer level packaging, silicon substrate and board material on gigabit board-silicon-board data transmission

DSpace at KOASAS

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Effect of wafer level packaging, silicon substrate and board material on gigabit board-silicon-board data transmission

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Kim W. / Madhavan R. / Mao J. / Choi J. / Choi S.researcher / Ravi D. / Sundaram V. / Gupta P. / Zhang Z. / Lo G. / Swaminathan M. / Tummala R. / Sitaraman S. / Wong C.P. / Iyer M. / Tay A. / Rotaru M. / Sankararaman S.

Issue Date: 2004-06-01

Language: ENG

Citation: 2004 Proceedings - 54th Electronic Components and Technology Conference, v.2, pp.1506 - 1512

ISSN: 0569-5503

URI: http://hdl.handle.net/10203/140987

Appears in Collection: RIMS Conference Papers

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