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NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
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PITTING RESISTANCE OF TIN DEPOSITED ON INCONEL-600 BY PLASMA-ASSISTED CHEMICAL-VAPOR-DEPOSITION In, C.B.; Kim, S.P.; Kim, Y.I.; Kim, W.W.; Kuk, I.H.; Chun , Soung Soon; Lee, Won-Jong, JOURNAL OF NUCLEAR MATERIALS, v.211, no.3, pp.223 - 230, 1994 | |
THE EFFECTS OF DEPOSITION TEMPERATURE ON THE INTERFACIAL PROPERTIES OF SIH4 REDUCED BLANKET TUNGSTEN ON TIN GLUE LAYER LEE, YJ; Park, Chong-Ook; KIM, DW; Chun , Soung Soon, JOURNAL OF ELECTRONIC MATERIALS, v.23, no.10, pp.1075 - 1080, 1994-10 | |
EFFECT OF THE SILICIDATION REACTION CONDITION ON THE GATE OXIDE INTEGRITY IN TI-POLYCIDE GATE LEE, NI; KIM, YW; AHN, ST, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, v.33, no.1B, pp.672 - 677, 1994-01 |
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