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Showing results 1 to 11 of 11

1
Avoidance of fabricational thermal residual stresses in co-cure bonded metal-composite hybrid structures

Kim, Hak Sung; Lee, Dai Gil, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.20, no.9, pp.959 - 979, 2006

2
Development of the trenchless rehabilitation process for underground pipes based on RTM

Chin, WS; Lee, Dai Gil, COMPOSITE STRUCTURES, v.68, no.3, pp.267 - 283, 2005-05

3
Dielectric cure monitoring for glass/polyester prepreg composites

Kim, HG; Lee, Dai Gil, COMPOSITE STRUCTURES, v.57, no.1-4, pp.91 - 99, 2002-07

4
Effects of applied pressure and temperature during curing operation on the strength of tubular single-lap adhesive joints

Kim, JK; Lee, Dai Gil, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.18, no.1, pp.87 - 107, 2004

5
In situ cure monitoring of adhesively bonded joints by dielectrometry

Kwon, JW; Chin, WS; Lee, Dai Gil, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.17, pp.2111 - 2130, 2003

6
Measurement of the degree of cure of carbon fiber epoxy composite materials

Kim, JS; Lee, Dai Gil, JOURNAL OF COMPOSITE MATERIALS, v.30, no.13, pp.1436 - 1457, 1996

7
Measurement of the degree of cure of glass fiber-epoxy composites using dielectrometry

Bang, KG; Kwon, JW; Lee, Dai Gil; Lee, JW, JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, v.113, no.1-3, pp.209 - 214, 2001-06

8
Non-isothermal in situ dielectric cure monitoring for thermosetting matrix composites

Lee, Dai Gil; Kim, HG, JOURNAL OF COMPOSITE MATERIALS, v.38, no.12, pp.977 - 993, 2004

9
Reduction of fabricational thermal residual stress of the hybrid co-cured structure using a dielectrometry

Kim, HS; Lee, Dai Gil, COMPOSITES SCIENCE AND TECHNOLOGY, v.67, pp.29 - 44, 2007-01

10
Repair of underground buried pipes with resin transfer molding

Lee, Dai Gil; Chin, WS; Kwon, JW; Yoo, AK, COMPOSITE STRUCTURES, v.57, no.1-4, pp.67 - 77, 2002-07

11
열경화성 수지 복합재료의 유전 경화 모니터링

김형근; 이대길, 비파괴검사학회지, v.23, no.5, pp.409 - 417, 2003-10

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