Browse "School of Electrical Engineering(전기및전자공학부)" by Subject Porous ultralow-k dielectrics▼apore-sealing▼abeyond Cu▼aRu interconnects▼aetch-back
Showing results 1 to 1 of 1
| Advanced interconnect engineering for porous ultralow-k dielectrics and beyond Cu metallization = 다공성 초저유전체와 신규 배선용 금속을 위한 차세대 배선 기술link Yoon, Seongjun; Cho, Byung Jin; et al, 한국과학기술원, 2019 |
Discover
Open Access
- 573 OA Article
Date issued
- 5,321 2020 - 2024
- 18,943 2010 - 2019
- 15,019 2000 - 2009
- 7,644 1990 - 1999
- 2,391 1980 - 1989