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Co-modeling, experimental verification, and analysis of chip-package hierarchical power distribution network Park, Hyun-Jeong; Kim, Hyung-Soo; Pak, Jun-So; Yoon, Chang-Wook; Koo, Kyoung-Choul; Kim, Joung-Ho, IEICE TRANSACTIONS ON ELECTRONICS, v.E91C, pp.595 - 606, 2008-04 |
Modeling and investigation of noise isolation in hierarchical power distribution network (PDN) for 3D system-in-package (SiP) = 3차원 시스템-인-패키지를 위한 계층적 전력 분배망의 잡음 분리에 관한 모델링 및 연구link Park, Hyun-Jeong; 박현정; et al, 한국과학기술원, 2009 |
저 잡음 시스템-온-패키지를 위한 온-칩 전력 접지 망의 측정 및 분석 = Analysis and measurement of on-chip power/ground network for low noise system-on-packagelink 박현정; Park, Hyun-Jeong; et al, 한국과학기술원, 2005 |
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