Browse "School of Electrical Engineering(전기및전자공학부)" by Subject TECHNOLOGY
Showing results 77 to 88 of 88
| The Efficacy of Metal-Interfacial Layer-Semiconductor Source/Drain Structure on Sub-10-nm n-Type Ge FinFET Performances Kim, Jeong-Kyu; Kim, Gwang-Sik; Nam, Hyohyun; Shin, Changhwan; Park, Jin-Hong; Kim, Jong-Kook; Cho, Byung-Jin; et al, IEEE ELECTRON DEVICE LETTERS, v.35, no.12, pp.1185 - 1187, 2014-12 |
| The enhancement of Q factor in RPCVD SiGe varactors by the structural modification of the base-collector junction Mheen, B; Suh, D; Kim, SH; Shim, KH; Kang, JY; Hong, Songcheol, IEEE ELECTRON DEVICE LETTERS, v.24, no.4, pp.239 - 241, 2003-04 |
| The influence of interfacial defects on fast charge trapping in nanocrystalline oxide-semiconductor thin film transistors Kim, Taeho; Hur, Jihyun; Jeon, Sanghun, SEMICONDUCTOR SCIENCE AND TECHNOLOGY, v.31, no.5, 2016-05 |
The Schottky barrier modulation at PtSi/Si interface by strain and structural deformation Srivastava, Pooja; Shin, Mincheol; Lee, Kwang-Ryeol; Mizuseki, Hiroshi; Kim, Seungchul, AIP ADVANCES, v.5, no.8, 2015-08 |
| Thermal Stability and Memory Characteristics of HfON Trapping Layer for Flash Memory Device Applications Jeon, Sanghun, ELECTROCHEMICAL AND SOLID STATE LETTERS, v.12, no.11, pp.H412 - H415, 2009 |
| Three-dimensional interconnect for multilayer module packages with selectively anodised aluminium substrate Yeo, S. K.; Kwon, Young Se, ELECTRONICS LETTERS, v.45, no.13, pp.678 - 680, 2009-06 |
| Three-dimensional solar steam generation device with additional non-photothermal evaporation Kim, Kwanghyun; Yu, Sunyoung; Kang, Se-Young; Ryu, Seung-Tak; Jang, Ji-Hyun, DESALINATION, v.469, 2019-11 |
| Through-Silicon-Via-Based Decoupling Capacitor Stacked Chip in 3-D-ICs Song, Eun-Seok; Koo, Kyoung-Choul; Pak, Jun-So; Kim, Joung-Ho, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.3, no.9, pp.1467 - 1480, 2013-09 |
| Ultraviolet photon induced bulk, surface and interface modifications in n-Hg0.8Cd0.2Te in hydrogen environment Agnihotri, OP; Pal, R; Yang, KD; Bae, SH; Lee, SJ; Lee, MY; Choi, WS; et al, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS, v.41, no.7A, pp.4500 - 4502, 2002-07 |
| Use of a Columnar Metal Thin Film as a Nanosieve with Sub-10 nm Pores Choi, Dong-Hoon; Han, Yong Duk; Lee, Byung-Kee; Choi, Seon-Jin; Yoon, Hyun C.; Lee, Dae-Sik; Yoon, Jun-Bo, ADVANCED MATERIALS, v.24, no.32, pp.4408 - 4413, 2012-08 |
| Vertically Integrated Nanowire-Based Unified Memory Lee, Byung-Hyun; Ahn, Dae-Chul; Kang, Min-Ho; Jeon, Seung-Bae; Choi, Yang-Kyu, NANO LETTERS, v.16, no.9, pp.5909 - 5916, 2016-09 |
| Very Low-Work-Function ALD-Erbium Carbide (ErC2) Metal Electrode on High-K Dielectrics Ahn, Hyun Jun; Moon, Jungmin; Koh, Sungho; Seo, Yujin; Kim, Choong-Ki; Rho, Il Cheol; Kim, Choon Hwan; et al, IEEE TRANSACTIONS ON ELECTRON DEVICES, v.63, no.7, pp.2858 - 2863, 2016-07 |
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