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Grounded-moating and shielding for noise-coupling reduction between adjacent packages and MCMS Kim, KD; Park, J; Lee, JG; Kim, Joungho; Lee, JH, MICROWAVE AND OPTICAL TECHNOLOGY LETTERS, v.45, pp.557 - 559, 2005-06 |
Noise coupling analysis and reduction in 3D-IC considering through-silicon via (TSV) nonlinearity = 3차원 집적회로에서 TSV의 비선형성을 고려한 노이즈 커플링 분석 및 감소에 관한 연구link Cho, Jong-Hyun; 조종현; et al, 한국과학기술원, 2013 |
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