Browse "School of Electrical Engineering(전기및전자공학부)" by Type Conference
Showing results 10041 to 10060 of 22768
| High-frequency Electrical Model of Chip-to-Chip Via Interconnection for 3-D Chip Stacking Package Kim, Joungho; Ryu, Chunghyun; Chung, Daehyun; Lee, Junho; Lee, Kwangyong; Oh, Taesung, IEEE 14th(13) Topical Meeting on Electrical Performance of Electronic Packaging, pp.151 - 154, IEEE, 2005-10 |
| High-frequency electrical performance of a new high-density Multiple Line Grid Array (MLGA) package Ahn, Seungyoung; Lee, Joon-Woo; Kim, Jonghoon; Ryu, Woongwhan; Kim, Young-Soo; Yoon, Chong K.; Kim, Joungho, 50th Electronic Components and Technology Conference, pp.497 - 501, Electronic Components and Technology Conference, 2000-05 |
| High-frequency Measurements of TSV failures Kim, Joohee; Cho, Jonghyun; Pak, Jun So; Kim, Joungho; Yook, Jong-Min; Kim, Jun Chul, 62nd Electronic Components and Technology Conference (ECTC), 62nd Electronic Components and Technology Conference (ECTC), 2012-05-29 |
| High-frequency modeling and signal integrity analysis of high-density silicone rubber socket Kim, Hyesoo; Park, Junyong; Park, Shinyoung; Kim, Jonghoon J; Kim, Joungho; Ha, Dongho; Bae, Michael; et al, IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016, pp.55 - 57, Institute of Electrical and Electronics Engineers Inc., 2016-12 |
| High-Frequency Performance of GaAs Floated Electron Channer FET(FECFET) Kwon, Young Se, International Conference on VLSI and CAD, 1993 |
| High-frequency switching class-D power amplifier for portable sound applications Choi, B.K.; Hong, Y.U.; Kwak, T.W.; Lee, M.C.; Cho, Gyu-Hyeong, 37th IEEE Power Electronics Specialists Conference 2006, PESC'06, pp.1 - 4, IEEE, 2006-06-18 |
| High-frequency TSV Failure Detection Method with Z parameter Kim, Joohee; Jung, Daniel H; Chok, Jonghyun; Pak, Jun So; Yook, Jong Min; Kim, Jun Chul; Kim, Joungho, IEEE 38th International symposium of Test and Failure Analysis (ISTFA), IEEE, 2012-11 |
| High-Freuquency TSV Failure Analysis Kim, Joohee; Cho, Jonghyun; Jung, Hyunsuk; Pak, Jun So; Yook, Jong-Min; Kim, Joungho; Kim, Jun Chul, 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEP 2011, 2011-10-24 |
| High-gain wide-bandwidth capacitor-less low-dropout regulator with zero insertion utilizing frequency response of inner loops Hong, Sung-Wan; Jung, Seungchul; Park, Changbyoung; Kong, Tae-Hwang; Jung, Min-Yong; Ryu, Seung-Tak; Cho, Gyu-Hyeong, 2013 IEEE Symposium on VLSI Circuits, SOVC 2013, pp.C168 - C169, IEEE, 2013-06-13 |
| High-K Dielectrics for Charge Trap - type Flash Memory Application Cho, Byung Jin; He, W; Pu, J, 2008 Asia-Pacific Workshop on Fundamentals and Applications on Advanced Semiconductor Devices, pp.37 - 41, 2008-07-09 |
| High-K HfAlO Charge Trapping Layer in SONOS-type Nonvolatile Memory Device for High Speed Operation Cho, Byung Jin; Tan, YN; Chim, WK; Choi, WK; Sig, JM; Hau, NT, International Electron Device Meeting (IEDM), December 2004, pp.889 - 892, 2004-12-13 |
| High-Mobility IGZO Thin-Film Transistors Fabricated on a Flexible PET Monofilament Fiber for Wearing Display Kim, Chanyoung; Park, Junhong; Park, Sang-Hee Ko; Choi, Kyung Cheol, Society for Information Display 2020 International Symposium, SID 2020, Society for Information Display, 2020-08 |
| High-Mobility ITGO Thin-Film Transistors on a Flexible PET Fiber for Wearing Display System Kim, Chanyoung; HWANG, YONGHA; Kong, Seonguk; Park, Sang-Hee Ko; Choi, Kyung Cheol, IMID 2020, IMID, 2020-08 |
| High-Order Associative Memories Park, Cheol Hoon, International Conference on Mathematical Modeling, pp.196 -, 1987 |
| High-Performace Variable-Length Packet Scheduling Algorithm for IP Packets Sung, Dan Keun; Moon, SH, GLOBECOM '01. IEEE Global Telecommunications Conference, v.4, pp.2666 - 2670, 2001-10 |
| High-performance ALD HfO2-Al2O3 laminate MIM capacitors for RF and mixed signal IC applications Cho, Byung Jin; Hu, H; Ding, SJ; Lim, HF; Zhu, C; Li, MF; Kim, SJ, International Electron Device Meeting (IEDM), pp.0 - 0, 2003-12-08 |
| High-performance coherent WDM PON using low-cost devices Kim, DAEHO; Kim, Hoon, ACP 2018, OSA, SPIE, IEEE, 2018-10-29 |
| High-Performance Copolymer Conductive-Bridging RAM (CBRAM) for Neuromorphic Computing Controlling the Copper Dissolution Oh, Jungyeop; Yang, Sang Yoon; Lee Changhyeon; Im, Sung Gap; Choi, Sung-Yool, NANO KOREA 2020, Korea Nanotechnology Research Society, 2020-07-02 |
| High-Performance Electrode Platform for Thin-Film Optoelectronic Devices Lee, Jung-Yong, International Workshop on Flexible & Printable Electronics (IWFPE) 2012, 한국디스플레이산업협회, 2012-11 |
| High-performance electroplated solenoid-type integrated inductor (SI2) for RF applications using simple 3D surface micromachining technology Yoon, Jun-Bo; Kim, BK; Han, CH; Yoon, Euisik; Lee, Kwyro; Kim, CK, Proceedings of the 1998 IEEE International Electron Devices Meeting, pp.544 - 547, 1998-12-06 |
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