Showing results 11 to 12 of 12
Signal quality test with 3-dimensional BER opening for non-coherent Ultra Wide-Band (UWB) System-in-Package (SiP) Yoon, C.; Kim, Joungho; Kim, J., 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009, 2009-12-02 |
Suppression of power/ground noise using Meshed-Planar Electromagnetic Bandgap (MP-EBG) structure for Ultra-Wideband (UWB) system-in-package (SiP) Kim, M.; Yoon, C.; Koo, K.; Hwang, C.; Sung, H.; Kim, Joungho, 2010 IEEE International Symposium on Electromagnetic Compatibility, EMC 2010, pp.28 - 31, IEEE, 2010-07-25 |
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