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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

Joining Technology and Joint Reliability between Flexible Substrate and Si Chip with Micro-bump

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dc.contributor.authorKo, Yong Hoko
dc.contributor.authorKim, Taek-Sooko
dc.contributor.authorBang, Jung-Hwanko
dc.contributor.authorLee, Chang-Wooko
dc.date.accessioned2015-07-22T04:33:10Z-
dc.date.available2015-07-22T04:33:10Z-
dc.date.created2015-07-08-
dc.date.issued2014-07-17-
dc.identifier.citation67th IIW International Conference-
dc.identifier.urihttp://hdl.handle.net/10203/199953-
dc.languageEnglish-
dc.publisherIIW-
dc.titleJoining Technology and Joint Reliability between Flexible Substrate and Si Chip with Micro-bump-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.publicationname67th IIW International Conference-
dc.identifier.conferencecountryKO-
dc.identifier.conferencelocationSheraton Grande Walkerhill, Seoul-
dc.contributor.localauthorKim, Taek-Soo-
dc.contributor.nonIdAuthorBang, Jung-Hwan-
dc.contributor.nonIdAuthorLee, Chang-Woo-
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ME-Conference Papers(학술회의논문)
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