DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, Won-Seock | ko |
dc.contributor.author | Shin, Kum-Cheol | ko |
dc.contributor.author | Jeong, Ju-Won | ko |
dc.contributor.author | Kim, Sang-Yeong | ko |
dc.contributor.author | Lee, Jung-Ju | ko |
dc.date.accessioned | 2015-01-29T05:34:17Z | - |
dc.date.available | 2015-01-29T05:34:17Z | - |
dc.date.created | 2014-12-23 | - |
dc.date.issued | 2014-07-30 | - |
dc.identifier.citation | IEEE International Nanoelectrnocis conference (IEEE INEC2014) | - |
dc.identifier.uri | http://hdl.handle.net/10203/193460 | - |
dc.language | English | - |
dc.publisher | Hokkaido University | - |
dc.title | Nano and micro morphological modification for the improvement of interfacial strength of bi-materials of CFRP/Aluminum | - |
dc.type | Conference | - |
dc.type.rims | CONF | - |
dc.citation.publicationname | IEEE International Nanoelectrnocis conference (IEEE INEC2014) | - |
dc.identifier.conferencecountry | JA | - |
dc.identifier.conferencelocation | Hokkaido University, Sapporo | - |
dc.contributor.localauthor | Lee, Jung-Ju | - |
dc.contributor.nonIdAuthor | Kim, Won-Seock | - |
dc.contributor.nonIdAuthor | Shin, Kum-Cheol | - |
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