DC Field | Value | Language |
---|---|---|
dc.contributor.author | Lee, TI | ko |
dc.contributor.author | Kim, C | ko |
dc.contributor.author | Kim, MS | ko |
dc.contributor.author | 김택수 | ko |
dc.date.accessioned | 2015-01-29T05:00:29Z | - |
dc.date.available | 2015-01-29T05:00:29Z | - |
dc.date.created | 2014-12-15 | - |
dc.date.issued | 2014-10-29 | - |
dc.identifier.citation | 2014 KSPE Fall Meeting | - |
dc.identifier.uri | http://hdl.handle.net/10203/193234 | - |
dc.language | English | - |
dc.publisher | KSPE | - |
dc.title | Measurement of Thermal Expansion Coefficient of FR4 Using Digital Image Correlation System for Warpage Prediction of Package Substrate | - |
dc.type | Conference | - |
dc.type.rims | CONF | - |
dc.citation.publicationname | 2014 KSPE Fall Meeting | - |
dc.identifier.conferencecountry | KO | - |
dc.identifier.conferencelocation | 창원컨벤션센터 | - |
dc.contributor.localauthor | 김택수 | - |
dc.contributor.nonIdAuthor | Lee, TI | - |
dc.contributor.nonIdAuthor | Kim, C | - |
dc.contributor.nonIdAuthor | Kim, MS | - |
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