Stress and Solution Chemistry Effects for Optimized CMP of Ultra-Low-k Dielectrics

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dc.contributor.authorKim, Taek-Soo-
dc.contributor.authorZhong, Q-
dc.contributor.authorPeterson, M-
dc.contributor.authorTam, H-
dc.contributor.authorKonno, T-
dc.contributor.authorDauskardt, R.H.-
dc.date.accessioned2014-11-12-
dc.date.available2014-11-12-
dc.date.created2014-01-14-
dc.date.issued2008-03-24-
dc.identifier.citationMaterials Research Society 2008 Spring Meeting, v., no., pp. --
dc.identifier.urihttp://hdl.handle.net/10203/191037-
dc.languageENG-
dc.publisherMaterials Research Society-
dc.titleStress and Solution Chemistry Effects for Optimized CMP of Ultra-Low-k Dielectrics-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.publicationnameMaterials Research Society 2008 Spring Meeting-
dc.identifier.conferencecountryUnited States-
dc.contributor.localauthorKim, Taek-Soo-
dc.contributor.nonIdAuthorZhong, Q-
dc.contributor.nonIdAuthorPeterson, M-
dc.contributor.nonIdAuthorTam, H-
dc.contributor.nonIdAuthorKonno, T-
dc.contributor.nonIdAuthorDauskardt, R.H.-
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ME-Conference Papers(학술회의논문)
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