Mechanical Reliability of Flip-Chip Packaging: from Cu/Low-k Interconnects to Underfill
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kim, Taek-Soo | - |
| dc.date.accessioned | 2014-11-12 | - |
| dc.date.available | 2014-11-12 | - |
| dc.date.created | 2014-01-14 | - |
| dc.date.issued | 2010-10-21 | - |
| dc.identifier.citation | Korea-SV Electronics Packaging Technology Workshop, v., no., pp. - | - |
| dc.identifier.uri | http://hdl.handle.net/10203/190997 | - |
| dc.language | ENG | - |
| dc.publisher | Korea-SV Electronics Packaging Technology Workshop | - |
| dc.title | Mechanical Reliability of Flip-Chip Packaging: from Cu/Low-k Interconnects to Underfill | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | Korea-SV Electronics Packaging Technology Workshop | - |
| dc.identifier.conferencecountry | United States | - |
| dc.contributor.localauthor | Kim, Taek-Soo | - |
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