Thermocompression ultrasonic bonding technology for mounting IT components with high-density pin counts고밀도 핀 배열의 IT 부품 실장을 위한 열압착 초음파 본딩 기술
- Advisors
- Kim, Kyung-Sooresearcher; 김경수
- Description
- 한국과학기술원 : 기계공학전공,
- Publisher
- 한국과학기술원
- Issue Date
- 2009
- Identifier
- 487968/325007 / 020073488
- Language
- eng
- Description
학위논문(석사) - 한국과학기술원 : 기계공학전공, 2009.2, [ x, 86 p. ]
- Keywords
LCD driver IC; Anisotropic conductive film; Curing rate; Thermocompression ultrasonic bonding; 비 등방성 전도성 필름; LCD 드라이브 IC; 경화도; 열압착 초음파 본딩; 최대 허용 진폭; maximum allowable amplitude
- Appears in Collection
- ME-Theses_Master(석사논문)
- Files in This Item
- There are no files associated with this item.
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