| 14581 | The Design and Science of Polyelemental Nanoparticles Koo, Won-Tae; Millstone, Jill E.; Weiss, Paul S.; Kim, Il-Doo, ACS NANO, v.14, no.6, pp.6407 - 6413, 2020-06 |
| 14582 | The design of low-temperature solder alloys and the comparison of mechanical performance of solder joints on ENIG and ENEPIG interface Wang, Shaoan; Chen, Xiangyu; Luo, Keyu; Zhou, Hongzhi; Li, Rongqing; He, Peng; Paik, Kyung-Wook; et al, JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, v.27, pp.5332 - 5339, 2023-11 |
| 14583 | The Development of Hypo-Stoichiometric Zr-Ti-V-Mn-Ni Hydrogen Storage Alloy for Anode Material of Ni/MH Secondary Lee, Jai Young, 13st IBA Marrakesh Symposium, 1999 |
| 14584 | The development of red emitting ZnS:Cu,Cl,Mn,Te AC powder electroluminescent (ACPEL) phosphor Park, BJ; Han, JY; Jeon, Duk Young; Seo, HS; Ahn, JT; Oh, DK; Park, SH; et al, 16th International Display Workshops, IDW '09, v.1, pp.379 - 381, 2009-12-09 |
| 14585 | The Development of Single-wall Carbon Nanotube and Peapod Carbon Nanotube FET Dvie for Memory Kim, Ho Gi, International Japan-Korea Semina on Ceramics, 2003 |
| 14586 | The development of Zr-based alloy with ultra high capacity and the improvement of performances by surface modification for Ni/MH rechargeable battery Lee, Jai Young, The 2nd International Symposium on New Protium Function in Materials, 2001 |
| 14587 | The Dielectric Constant Dependence on Grain Size in Tetragonal and Rhombohedral Phase PZT Ceramics after Poling Kim, Ho Gi, 91th Annual Meeting of the Am. Ceram. Soc. Inc. (U.S.A.), 1989 |
| 14588 | The doped Pd on the crystal calculation and intermetallic property of low-temperature soldered ENEPIG substrates Zhang, Shuye; Wang, Shaoan; Zhang, Shang; Chen, Xiangyu; Zeng, Chen; Paik, Kyung-Wook; He, Peng, JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, v.27, pp.7094 - 7099, 2023-11 |
| 14589 | The drastic changes in the electrical properties of doped hydrogenated amorphous silicon as a resistive layer material during vacuum packaging processes in field emission display Ha J.K.; Chung B.H.; Han S.Y.; Choi J.O.; Kim, Ho Gi, Proceedings of the 14th International Vacuum Microelectronics Conference, pp.217 - 218, 2001-08-12 |
| 14590 | The Dynamic Studies on Voids Formation during making in Silicon Wafer Bonding 강상원, 한국전자공학회, 합동학술발표회 논문집 제10호, 제1권, pp.219 -, 1992 |
| 14591 | The Effect fo Mo or Re Addition on the Liquid Phase Sintering of W Heavy Alloy Yoon, Duk Yong, ibid., pp.525 - 530, 1995 |
| 14592 | The effect of a dilution agent on the dipping exothermic reaction process for fabricating a high-volume TiC-reinforced aluminum composite Song, IH; Kim, Do Kyung; Hahn, YD; Kim, HD, SCRIPTA MATERIALIA, v.48, no.4, pp.413 - 418, 2003-02 |
| 14593 | The Effect of A Parasitic Potential Barrier on the Neutral Base Recombination Current of Si/SiGe/Si DHBTs Sang-Won Kang; Sung-Ihl Kim; Byung R.Ryum; Wonchan Kim, SOLID-STATE ELECTRONICS, v.37, no.3, pp.517 - 519, 1994-01 |
| 14594 | THE EFFECT OF A ZNTE BUFFER LAYER ON THE STRUCTURAL AND OPTICAL-PROPERTIES OF THE CDTE/ZNTE/GAAS STRAINED HETEROSTRUCTURES GROWN BY TEMPERATURE-GRADIENT VAPOR-TRANSPORT DEPOSITION KIM, TW; PARK, HL; Lee, JeongYong, APPLIED PHYSICS LETTERS, v.67, no.16, pp.2388 - 2390, 1995-10 |
| 14595 | The effect of addition of Gd, La into YVO4:Eu3+ red phosphor Jeon, Duk Young; Kang, JH; Im, WB; Lee, DC; Kim, JY, 2003 International Meeting on Information Display, pp.1017 - 1020, 2003 |
| 14596 | The effect of additives on the precipitation behavior of Ag-Pd-In dental alloy 이진형, 대한금속재료학회, 2000 |
| 14597 | The Effect of Air Impurities on the PEMFC Performances Cho, Eun-Ae; Jang, JH.; Kim, YY.; Son, JH.; Lee, SY.; Kim, HJ.; Lim, TH.; et al, Fuel Cell Seminar, Fuel Cell Seminar, 2008-10-28 |
| 14598 | The effect of Al on mechanical properties and microstructures of Fe-32Mn-12Cr-xAl-0.4C cryogenic alloys Han, YS; Hong, Soon-Hyung, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.222, no.1, pp.76 - 83, 1997-01 |
| 14599 | The Effect of Alumina powder filled Polyimide Adhesive on the Thermo-Mechanical Stress of Lead-On-Chip Package Paik, Kyung-Wook, 3rd Pan Pacific Microelectronics Sym., pp.429 - 434, 1998-02-01 |
| 14600 | The effect of amino-silane coupling agents having different molecular structures on the mechanical properties of basalt fiber-reinforced polyamide 6,6 composites Yu, Si-won; Oh, Kyung Hwan; Hwang, Jun Yeon; Hong, Soon H., COMPOSITES PART B-ENGINEERING, v.163, pp.511 - 521, 2019-04 |
