Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Title
Showing results 1441 to 1460 of 19223
| Analysis of the Dislocation Structures Induced by Hydride Formation and Decomposition LaNi5 Lee, Jai Young, Proc. of the first Int. Cong. New Energy Systems and Conversion, 1992 |
| Analysis of the grain boundary conductivity of singly and doubly doped CeO2 thin films at elevated temperature Kwak, No Woo; Jung, Woochul, ACTA MATERIALIA, v.108, pp.271 - 278, 2016-04 |
| Analysis of the master curve approach on the fracture toughness properties of SA508 Gr.4N Ni-Mo-Cr low alloy steels for reactor pressure vessels Lee, Ki-Hyoung; Kim, Min-Chul; Lee, Bong-Sang; Wee, Dang-Moon, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.527, no.15, pp.3329 - 3334, 2010-06 |
| Analysis of the Nonlinear Mott-Schottky Plot Resulting in Anodic TiO2 Films 변수일, Korean Corros. Sci. Soc., pp.43 - 43, 1990 |
| Analysis of the spatially distributed performance degradation of a polymer electrolyte membrane fuel cell stack Cho, Min Kyung; Lee, Dae-Nyung; Kim, Yi-Young; Han, Jonghee; Kim, Hyoung-Juhn; Cho, Eun-Ae; Lim, Tae-Hoon; et al, INTERNATIONAL JOURNAL OF HYDROGEN ENERGY, v.39, no.29, pp.16548 - 16555, 2014-10 |
| Analysis of the Stress Generated during Phase Boundary Movement in Pure and Co(OH)2 Incorporated Ni(OH)2 Film Electrodes Using Laser Beam Deflection and Current Transient Techniques 변수일, The Korean Electrochemical Society, pp.49 - 49, 1999 |
| Analysis of the Stress Generation and Relaxation during Hydrogen Absorption/desorption into/from and Diffusion in Pd Foil Electrode Pyun, Su Il, International Conference on Electronic Materials (IUMRS-ICEM-98), 1998 |
| Analysis of the T-peel strength in a Cu/Cr/polyimide system Song, JY; Yu, Jin, ACTA MATERIALIA, v.50, no.16, pp.3985 - 3994, 2002-09 |
| Analysis of Thermal Properties of SiCp/Al Metal Matrix Composites for Thermal Management Applications Hong, Soon-Hyung, pp.0 - 0, 2001-01-01 |
| Analysis of vertical phase distribution in reactively sputtered zinc oxysulfide thin films Cho, Dae-Hyung; Lee, Woo-Jung; Shin, Byungha; Chung, Yong-Duck, APPLIED SURFACE SCIENCE, v.486, pp.555 - 560, 2019-08 |
| Analysis on interfacial failures of ultra-fine pitch wire with low inter-metallic coverage Shin, JW; Song, MS; Park, YS; Kwon, YM; Moon, JT; Cho, JS; Yoo, KA; et al, 2009 11th Electronic Packaging Technology Conference, EPTC 2009, pp.942 - 946, 2009-12-09 |
| Analysis on switching mechanism of graphene oxide resistive memory device Hong, Seul Ki; Kim, Ji Eun; Kim, Sang Ouk; Cho, Byung Jin, JOURNAL OF APPLIED PHYSICS, v.110, no.4, 2011-08 |
| Analysis on the Load Transfer Efficiencies of Whisker and Particulate Reinforcements in Metal Matrix Composite Hong, Soon-Hyung; Ryu, HJ, 4th International Conference on Advances in Materials and Processing Technologies, pp.592 - 597, 1998 |
| Analysis on the Load Transfer Efficiency of Whiskers in Metal Matrix Composites Hong, Soon-Hyung; Chung, KH, 11th International Conference on Composite Materials, pp.15 - 23, 한국복합재료학회, 1996-01-01 |
| Analysis on the Load Transfer to Reinforcement in Metal Matrix Composites Hong, Soon-Hyung, 11th Interantional Conference on Composite Materials15, 한국복합재료학회, 1997-01-01 |
| Analysis on the Load Trasfer Efficiencies of Whisker and Particulate Reinforcements in Metal Matrix Composite Ryu, Ho Jin; Hong, Soon Hyung, 4th Int. Conf. on Advances in Materials and Processing Tech., pp.592 - 597, AMPT, 1998-08 |
| Analysis on the martensitic transformation in the Ti-xNb alloys using a phenomenological theory Jeong, H.W.; Kim, S.E.; Jo, C.Y.; Lee, Y.T.; Park, Joong Keun, DIFFUSION AND DEFECT DATA PT.B: SOLID STATE PHENOMENA, v.124-126, no.PART 2, pp.1669 - 1672, 2007-06 |
| Analysis on the Passive Films of Fe, Cr and Fe-25Cr Alloy by Photo-Electrochemical Methods Kwon, Hyuk-Sang, , 1997-01-01 |
| Analysis on the passive films of Fe, Cr and Fe-25Cr alloy by photo-electrochemical methods Kim, JS; Kwon, Hyuk-Sang, ELECTROCHEMICAL METHODS IN CORROSION RESEARCH VI, PTS 1 AND 2, v.289-2, pp.1119 - 1126, 1998 |
| Analytical Approach to Evaluate Shear Stress in flip Chip Interconnection using NCA/ACF Lee, Soon-Bok; Paik, Kyung-Wook; Kwom, WS; Yang, SY, 5th International Symposium on Electronic Materials and Packagings 2003, pp.204 - 209, 2002 |
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- 2,031 2020 - 2024
- 6,675 2010 - 2019
- 5,357 2000 - 2009
- 3,582 1990 - 1999
- 982 1980 - 1989