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Effect of Al addition in Sn-Ag solder on the interfacial reactions with Cu and ENIG metallizations Jee, YK; Xia, YH; Yu, Jin; Kang, HW; Lee, TY, 58th Electronic Components and Technology Conference, ECTC 2008, pp.491 - 494, 2008-05-27 |
Effect of Aluminum Concentration on the Interfacial Reactions of Sn-3.0Ag-xAl Solders with Copper and ENIG Metallizations Xia, YH; Jee, YK; Yu, Jin; Lee, TY, JOURNAL OF ELECTRONIC MATERIALS, v.37, no.12, pp.1858 - 1862, 2008-12 |
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