Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Author Seo, Sun-Kyoung
Showing results 1 to 19 of 19
| An Investigation of Microstructure and Microhardness of Sn-Cu and Sn-Ag Solders as Functions of Alloy Composition and Cooling Rate Seo, Sun-Kyoung; Kang, Sung K.; Shih, Da-Yuan; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.38, no.2, pp.257 - 265, 2009-02 |
| Comparison of Sn2.8Ag20In and Sn10Bi10In solders for intermediate-step soldering Seo, Sun-Kyoung; Cho, Moon Gi; Lee, HyuckMo; Choi, Won Kyoung, JOURNAL OF ELECTRONIC MATERIALS, v.35, no.11, pp.1975 - 1981, 2006-11 |
| Crystal orientation of beta-Sn grain in Ni(P)/Sn-0.5Cu/Cu and Ni(P)/Sn-1.8Ag/Cu joints Seo, Sun-Kyoung; Cho, Moon Gi; Lee, HyuckMo, JOURNAL OF MATERIALS RESEARCH, v.25, no.10, pp.1950 - 1957, 2010-10 |
| Demonstration and characterization of Sn-3.0Ag-0.5Cu/Sn-57Bi-1Ag combination solder for 3-D multistack packaging Jo, Yun-Hwan; Lee, Joo-Won; Seo, Sun-Kyoung; Lee, Hyuck-Mo; Han, Hun; Lee, Dong-Chun, JOURNAL OF ELECTRONIC MATERIALS, v.37, no.1, pp.110 - 117, 2008-01 |
| Effect of Ag Addition on the Ripening Growth of Cu6Sn5 Grains at the Interface of Sn-xAg-0.5Cu/Cu During a Reflow Cho, Moon-Gi; Park, Yong-Sung; Seo, Sun-Kyoung; Paik, Kyung-Wook; Lee, Hyuck-Mo, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.1, no.12, pp.1939 - 1946, 2011-12 |
| Effects of Be and Co addition on the growth of Sn whiskers and the properties of Sn-based Pb-free solders Chang, Jaewon; Seo, Sun-Kyoung; Cho, Moon Gi; Lee, Dong Nyung; Kang, Kyoo-Sik; Lee, Hyuck Mo, JOURNAL OF MATERIALS RESEARCH, v.27, no.14, pp.1877 - 1886, 2012-07 |
| Effects of Co Addition on Bulk Properties of Sn-3.5Ag Solder and Interfacial Reactions with Ni-P UBM Kim, Dong Hoon; Cho, Moon Gi; Seo, Sun-Kyoung; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.38, no.1, pp.39 - 45, 2009-01 |
| Effects of under bump metallization and nickel alloying element on the undercooling behavior of Sn-based, Pb-free solders Cho, Moon Gi; Kang, Sung K.; Seo, Sun-Kyoung; Shih, Da-Yuan; Lee, HyuckMo, JOURNAL OF MATERIALS RESEARCH, v.24, no.2, pp.534 - 543, 2009-02 |
| Electromigration Performance of Pb-free Solder Joints in Terms of Solder Composition and Joining Path Seo, Sun-Kyoung; Kang, Sung K.; Cho, Moon Gi; Lee, HyuckMo, JOM, v.62, no.7, pp.22 - 29, 2010-07 |
| Enhancement of heterogeneous nucleation of beta-Sn phases in Sn-rich solders by adding minor alloying elements with hexagonal closed packed structures Cho, Moon Gi; Kim, Hyun You; Seo, Sun-Kyoung; Lee, HyuckMo, APPLIED PHYSICS LETTERS, v.95, no.2, pp.021905-1 - 021905-3, 2009-07 |
| Hermetic Sealing에 적합한 Pb-free 솔더 재료 선택과 공정구현 = The selection of Pb-free solder materials and demonstration for hermetic sealinglink 서선경; Seo, Sun-Kyoung; et al, 한국과학기술원, 2005 |
| Interfacial Reactions and Microstructures of Sn-0.7Cu-xZn Solders with Ni-P UBM During Thermal Aging Cho, Moon Gi; Kang, Sung K.; Seo, Sun-Kyoung; Shih, Da-Yuan; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.38, no.11, pp.2242 - 2250, 2009-11 |
| Phase Equilibria in the Sn-Ni-Zn Ternary System: Isothermal Sections at 200A degrees C, 500A degrees C, and 800A degrees C Chang, Jaewon; Seo, Sun-Kyoung; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.39, no.12, pp.2643 - 2652, 2010-12 |
| The Crystal Orientation of beta-Sn Grains in Sn-Ag and Sn-Cu Solders Affected by Their Interfacial Reactions with Cu and Ni(P) Under Bump Metallurgy Seo, Sun-Kyoung; Kang, Sung K.; Cho, Moon Gi; Shih, Da-Yuan; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.38, no.12, pp.2461 - 2469, 2009-12 |
| The evolution of microstructure and microhardness of Sn-Ag and Sn-Cu solders during high temperature aging Seo, Sun-Kyoung; Kang, Sung K.; Shih, Da-Yuan; Lee, HyuckMo, MICROELECTRONICS RELIABILITY, v.49, no.3, pp.288 - 295, 2009-03 |
| Thermodynamic assessment of the Ni-Bi binary system and phase equilibria of the Sn-Bi-Ni ternary system Seo, Sun-Kyoung; Cho, Moon Gi; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.36, no.11, pp.1536 - 1544, 2007-11 |
| Undercooling, Microstructures and Hardness of Sn-Rich Pb-Free Solders on Cu-xZn Alloy Under Bump Metallurgies Cho, Moon Gi; Seo, Sun-Kyoung; Lee, HyuckMo, MATERIALS TRANSACTIONS, v.50, no.9, pp.2291 - 2296, 2009-09 |
| Wettability and interfacial reactions of Sn-based Pb-free solders with Cu-xZn alloy under bump metallurgies Cho, Moon Gi; Seo, Sun-Kyoung; Lee, HyuckMo, JOURNAL OF ALLOYS AND COMPOUNDS, v.474, no.1-2, pp.510 - 516, 2009-04 |
| β-Sn grain orientations in Pb-free solders and their effect on the reliability of solder joints = 무연 솔더의 β-Sn 결정립 방향성과 솔더 조인트 신뢰성에 미치는 영향link Seo, Sun-Kyoung; 서선경; et al, 한국과학기술원, 2010 |
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