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Showing results 1 to 11 of 11

1
A Study on Nano-Sized Silica Contents and Size Effect in Non-conductive Films (NCFs) for Ultra Fine-Pitch Cu-Pillar/Sn-Ag Micro-Bump Interconnection

Lee, Hanmin; Lee, Seyong; Cho, Semin; Yu, Younghyun; Park, Jongho; Paik, Kyung-Wook, 67th IEEE Electronic Components and Technology Conference, ECTC 2017, pp.399 - 404, Institute of Electrical and Electronics Engineers Inc., 2017-05

2
A Study on the Curing properties and Viscosities of Non-Conductive Films (NCFs) for Sn-Ag Solder Bump Flip Chip Assembly

Lee, Hanmin; Lee, Seyong; Park, Jong-Ho; Chung, Chang-Kyu; Jang, Kyung-Woon; Kim, Il; Choi, SeongWoo; et al, 68th IEEE Electronic Components and Technology Conference (ECTC), pp.2464 - 2469, IEEE-CPMT, 2018-06-01

3
A Study on the Double layer Non Conductive Films (D-NCFs) For Highly Reliable Fine Pitch Flip ChipInterconnection

Lee, Seyong; Paik, Kyung Wook, 15th International Symposium on Microelectronics and Packaging (ISMP 2016), The Korean Microelectronics and Packaging Society, 2016-10-25

4
Effect of Material Properties of Double-Layer Non Conductive Films (D-NCFs) On the Reflow Reliability of Ultra Fine-pitch Cu-pillar/Sn-Ag Micro Bump Interconnection

Lee, Seyong; Shin, JiWon; Kim, Woojeong; Choi, Taejin; Paik, Kyung-Wook, IEEE 67th Electronic Components and Technology Conference (ECTC), pp.2110 - 2115, IEEE-CPMT, 2017-06-01

5
Effect of the Curing Properties and Viscosities of Nonconductive Films on the Solder Joint Morphology and Reliability of Chip-On-Board Packages Using Cu-Pillar/Sn-Ag Bumps

Lee, Hanmin; Lee, Seyong; Choi, Taejin; Park, Sooin; Ko, Eun Kyoung; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.10, no.5, pp.924 - 928, 2020-05

6
Effects of PCB Pad Metal Finishes on the Cu-Pillar/Sn-Ag Micro Bump Joint Reliability of Chip-on-Board (COB) Assembly

Kim, Youngsoon; Lee, Seyong; Shin, Ji Won; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.45, no.6, pp.3208 - 3219, 2016-06

7
Fabrication and Characterization of Epoxy Molding Films (EMFs) for Wafer-Level and Panel-Level Fan Out Packages

Park, Jong-Ho; Lee, Hanmin; Lee, Seyong; Kyung, Youjin; Kim, Jung Hak; Lee, Kwangjoo; Paik, Kyung-Wook, 68th IEEE Electronic Components and Technology Conference (ECTC), pp.712 - 717, IEEE-CPMT, 2018-05-31

8
Novel dielectric BN/epoxy nanocomposites with enhanced heat dissipation performance for electronic packaging

Lee, Dongju; Lee, Seyong; Byun, Segi; Paik, Kyung-Wook; Song, Sung Ho, COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, v.107, pp.217 - 223, 2018-04

9
The Effect of Double-Layer Nonconductive Films on the Solder Sidewall Wetting and the Reliability of 40-mu m Cu-Pillar/SnAg Microbumps for Chip-on-Chip Interconnection

Lee, Seyong; Lee, Hanmin; Shin, SangMyung; Jang, MinGu; Choi, TaeJin; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.6, pp.1167 - 1175, 2019-06

10
The Effect of the SnAg Solder Joint Morphology on the Thermal Cycle Reliability of 40 mu m Fine-pitch Cu-pillar/SnAg Micro Bump Interconnection

Lee, Seyong; Lee, Hanmin; Park, JongHo; Shin, SangMyung; Kim, Woojeong; Choi, Taejin; Paik, Kyung-Wook, 68th IEEE Electronic Components and Technology Conference (ECTC), pp.649 - 655, IEEE-CPMT, 2018-05-30

11
Wafer-Level Double-Layer Nonconductive Films for Flip-Chip Assembly

Lee, Seyong; Lee, HanMin; Shin, Ji Won; Kim, Woojeong; Choi, Taejin; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.8, pp.1258 - 1264, 2017-08

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