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Effects of Variation of Cu UBM Thickness in Electrodeposited Pure Tin Solder Microbumps Yu, Jin; Kim, JY; Jurenka, C; Wolf, J; Engelmann, G; Herbert Reichl, EMAP 2004 Proceedings, pp.373 - 378, 2004 |
Investigation of UBM Systems for Electroplated Sn/37Pb and Sn/3.5Ag Solder Bumps Jang, SY; Jurgen Wolf; Oswin Ehrmann; Heinz Gloor; Herbert Reichl; Paik, Kyung-Wook, MicroSystem Technologies, MicroSystem Technologies, 2001-03-27 |
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