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Showing results 1 to 12 of 12

1
A study on the crystallographic orientation with residual stress and electrical property of Al films deposited by sputtering

Kim, SP; Choi, HM; Choi, Si-Kyung, THIN SOLID FILMS, v.322, no.1-2, pp.298 - 302, 1998-06

2
(A) study on residual stresses in electroless Ni(P) and Ni(P)/Sn films and peel strengths of Cu/Cr/Polyimide system = 무전해 Ni(P) 및 Ni(P)/Sn 박막의 잔류응력과 Cu/Cr/Polyimide 계의 필강도 해석에 대한 연구link

Song, Jae-Yong; 송재용; et al, 한국과학기술원, 2003

3
Behavior of residual stress on CVD diamond films

Kim, JG; Yu, Jin, MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY, v.57, no.1, pp.24 - 27, 1998-12

4
CoCrPt계 수직기록매체의 결정립 미세화 및 교환상호작용 감소에 관한 연구 = A study on grain refinement and exchange coupling reduction in CoCrPt perpendicular recording medialink

홍대훈; Hong, Dae-Hoon; et al, 한국과학기술원, 2005

5
Effect of interfacial carbide layer on the Raman spectra in chemical-vapor deposited diamond films

Kim, JG; Yu, Jin; Lee, JC, JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES REVIEW PAPERS, v.38, no.2A, pp.777 - 780, 1999-02

6
Effects of CoZrNb surface morphology on magnetic properties and grain isolation of CoCrPtO perpendicular recording media

Hong, DH; Park, SH; Lee, Taek Dong, IEEE TRANSACTIONS ON MAGNETICS, v.41, pp.3148 - 3150, 2005-10

7
Influence of film density on residual stress and resistivity for Cu thin films deposited by bias sputtering

Choi, HM; Choi, Si-Kyung; Anderson, O; Bange, K, THIN SOLID FILMS, v.358, no.1-2, pp.202 - 205, 2000-01

8
Measurement of residual stress in diamond films obtained using chemical vapor deposition

Kim, JG; Yu, Jin, JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS EXPRESS LETTERS, v.37, no.7B, pp.890 - 893, 1998-07

9
Numerical Simulation on residual stress distribution of hard-face-welded steel specimens with martensite transformation

Yang, QX; Yao, M; Park, Joong Keun, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.364, no.1-2, pp.244 - 248, 2004-01

10
Polyimide 위에 스퍼터 증착한 Cu 및 Cr 박막의 잔류응력에 관한 연구 = A study on the residual stress of sputter-deposited Cu and Cr thin films on polyimidelink

조성일; Cho, Sung-Il; et al, 한국과학기술원, 2001

11
Residual stress and interfacial reaction of the electroplated Ni-Cu alloy under bump metallurgy in the flip-chip solder joint

Kim, SH; Kim, JY; Yu, Jin; Lee, TY, JOURNAL OF ELECTRONIC MATERIALS, v.33, no.9, pp.948 - 957, 2004-09

12
반응성 스퍼터링법에 의한 $Pb(Zr,Ti)O_3$ 압전 박막의 제조 및 특성평가 = Preparation and characterization of $Pb(Zr,Ti)O_3$ piezoelectric thin films by reactive sputteringlink

김혁환; Kim, Hyuk-Hwan; et al, 한국과학기술원, 2001

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