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Showing results 1 to 5 of 5

1
Integration of Large-Area Halide Perovskite Single Crystals and Substrates via Chemical Welding Using an Ionic Liquid for Applications in X-ray Detection

Kim, Min Kyu; Choi, Young Seung; Kim, Dooho; Heo, Kang; Oh, Seung Jin; Lee, Sujeong; An, Jeongho; et al, ACS APPLIED MATERIALS & INTERFACES, v.15, no.49, pp.57404 - 57414, 2023-11

2
Long-term oxidation properties of Al-Ti-Cr two-phase alloys as coating materials for TiAl alloys

Lee, JK; Oh, MH; Wee, Dang-Moon, INTERMETALLICS, v.10, no.4, pp.347 - 352, 2002-04

3
Ultrasonic Bonding Using Anisotropic Conductive Films (ACFs) for Flip Chip Interconnection

Lee, Ki-Won; Kim, Hyoung-Joon; Yim, Myung-Jin; Paik, Kyung-Wook, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.32, no.4, pp.241 - 247, 2009-10

4
연성 기판-유기 경성 기판간의 상온 초음파 ACF 접합 공정에 관한 연구 = Ultrasonic anisotropic conductive films (ACFs) bonding of flexible substrates on organic rigid boards at room temperaturelink

이기원; Lee, Ki-Won; et al, 한국과학기술원, 2007

5
주석-아연 무연 솔더 층을 이용한 실리콘 웨이퍼 접합에 관한 연구 = A study on the silicon wafer bonding using Sn-Zn Pb-free solder layerlink

정용; Jung, Yong; et al, 한국과학기술원, 2008

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