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Showing results 1 to 16 of 16

1
A study on material properties and reliability of Epoxy/ $BaTiO_3$ Embedded Capacitor Films (ECFs) in organic substrates = 유기기판용 에폭시/ $BaTiO_3$ 내장형 커패시터 필름의 재료 물성 및 신뢰성에 관한 연구link

Lee, Sang-Yong; 이상용; et al, 한국과학기술원, 2010

2
A Study on the Dynamic Bending Property of Chip-on-Flex Assembly Using Anchoring Polymer Layer Anisotropic Conductive Films

Pan, Yan; Oh, Seung-Jin; Kim, Ji-Hye; Kim, Taek-Soo; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.10, no.6, pp.941 - 948, 2020-06

3
A study on the effects of anisotropic conductive film (ACF) properties on interconnection stability of ACF flip-chip assemblies = 이방성 전도성 필름 특성이 플립칩 어셈블리의 접속 안정성에 끼치는 영향에 대한 연구link

Chung, Chang-Kyu; 정창규; et al, 한국과학기술원, 2010

4
(A) study on the interface of organic rigid substrates and flexible substrates bonding using anisotropic conductive adhesives = 이방성 전도성 접착제를 이용한 유기 경성-연성 기판간 접합계면에 관한 연구link

Kim, Hyoung-Joon; 김형준; et al, 한국과학기술원, 2007

5
$Cu_{100-x}Cr_x$ 박막과 폴리이미드의 접착력 연구 = A study on the adhesion of $Cu_{100-x}Cr_x$ thin films deposited on polyimidelink

안은철; Ahn, Eun-Chul; 이원종; 유진; et al, 한국과학기술원, 1996

6
Effects of microstructure of electrodeposits (Sn, Cu and Ni) on the reliability of three-dimensional interconnections = 전해전착법으로 형성된 금속배선(Sn, Cu and Ni)의 미세구조가 3차원 적층 반도체 패키지 신뢰성에 미치는 영향link

Park, Mi-Seok; 박미석; et al, 한국과학기술원, 2017

7
Effects of silica filler and diluent on material properties and reliability of non-conductive pastes (NCPs) for flip-chip applications = 실리카 필러와 희석제가 플립칩용 비전도성 페이스트의 물성 및 신뢰성에 미치는 영향link

Jang, Kyung-Woon; 장경운; et al, 한국과학기술원, 2003

8
Elongation improvement of transparent and flexible surface protective coating using polydimethylsiloxane-anchored epoxy-functionalized siloxane hybrid composite for reliable out-foldable displays

Lee, Hyunhwan; Lee, Yung; Lee, Sun Woo; Kang, Seung-Mo; Kim, Yun Hyeok; Jo, Woosung; Kim, Taek-Soo; et al, COMPOSITES PART B-ENGINEERING, v.225, 2021-11

9
Highly reliable hybrid nano-stratified moisture barrier for encapsulating flexible OLEDs

Jeong, Eun Gyo; Han, Yun Cheol; Im, Hyeon-Gyun; Bae, Byeong-Soo; Choi, Kyung Cheol, ORGANIC ELECTRONICS, v.33, pp.150 - 155, 2016-06

10
LCD 패키징용 이방성전도필름의 전기전도기구와 신뢰성에 관한 연구 = A study on the electrical conduction mechanism and reliability of anisotropically conductive films(ACFs) for LCD packaging applicationslink

임명진; Yim, Myung-Jin; et al, 한국과학기술원, 1997

11
Low-Temperature Bonding of PZT (PbZrTiO3) and Flexible Printed Circuits Using Sn52In Solder Anisotropic Conductive Films for Flexible Ultrasonic Transducers

Park, Jae-Hyeong; Park, Jong Cheol; Shin, SangMyung; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.11, pp.2152 - 2159, 2019-11

12
Material properties of anisotropic conductive adhesives (ACAs) and flip chip assembly reliability for chip-on-board (COB) applications = Chip-on-Board (COB) 패키지를 위한 이방성 전도성 접착제의 물성 및 플립칩 신뢰성에 관한 연구link

Jang, Kyung-Woon; 장경운; et al, 한국과학기술원, 2008

13
Reliable single-phase micro-joints with high melting point for 3D TSV chip stacking

Tian, Ye; Fang, Heng; Ren, Ning; Zhao, Yatao; Chen, Boli; Wu, Fengshun; Paik, Kyung-Wook, JOURNAL OF ALLOYS AND COMPOUNDS, v.828, 2020-07

14
Studies on assembly and reliability of Cu/SnAg double-bump flip chip on organic substrates for fine pitch applications = Cu/SnAg 더블 범프를 이용한 미세 피치 플립칩 접속 및 신뢰성에 관한 연구link

Son, Ho-Young; 손호영; et al, 한국과학기술원, 2008

15
The preparation of anisotropic conductive paste and its application in FOB interconnection

Cai, Xionghui; Zhai, Aixia; Zhou, Chenglong; Paik, Kyung-Wook, MICROELECTRONICS INTERNATIONAL, v.40, no.2, pp.166 - 171, 2023-03

16
나노인덴터를 활용한 RF MEMS 스위치의 신뢰성 평가 연구 = Characterization of contact reliability in RF MEMS switch using nano-indenterlink

김동석; Kim, Dong-Seok; et al, 한국과학기술원, 2010

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