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Effect of Aluminum Concentration on the Interfacial Reactions of Sn-3.0Ag-xAl Solders with Copper and ENIG Metallizations Xia, YH; Jee, YK; Yu, Jin; Lee, TY, JOURNAL OF ELECTRONIC MATERIALS, v.37, no.12, pp.1858 - 1862, 2008-12 |
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