Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Subject INTERMETALLIC COMPOUNDS
Showing results 1 to 12 of 12
| Abnormal grain growth of Ni3Sn4 at Sn-33Ag/Ni interface Kim, JH; Jeong, SW; Lee, HyuckMo, MATERIALS TRANSACTIONS, v.45, no.3, pp.710 - 713, 2004-03 |
| Comparison of electroplated eutectic Bi/Sn and Pb/Sn solder bumps on various UBM systems Jang, SY; Paik, Kyung-Wook, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.24, no.4, pp.269 - 274, 2001-10 |
| Effect of Ag Addition on the Ripening Growth of Cu6Sn5 Grains at the Interface of Sn-xAg-0.5Cu/Cu During a Reflow Cho, Moon-Gi; Park, Yong-Sung; Seo, Sun-Kyoung; Paik, Kyung-Wook; Lee, Hyuck-Mo, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.1, no.12, pp.1939 - 1946, 2011-12 |
| Effect of Aluminum Concentration on the Interfacial Reactions of Sn-3.0Ag-xAl Solders with Copper and ENIG Metallizations Xia, YH; Jee, YK; Yu, Jin; Lee, TY, JOURNAL OF ELECTRONIC MATERIALS, v.37, no.12, pp.1858 - 1862, 2008-12 |
| Effect of Cu content on the mechanical reliability of Ni/Sn-3.5Ag system Kim, JY; Sohn, YC; Yu, Jin, JOURNAL OF MATERIALS RESEARCH, v.22, no.3, pp.770 - 776, 2007-03 |
| Effects of Zn addition on the drop reliability of Sn-3.5Ag-xZn/Ni(P) solder joints Jee, YK; Yu, Jin; Ko, YH, JOURNAL OF MATERIALS RESEARCH, v.22, no.10, pp.2776 - 2784, 2007-10 |
| Effects of Zn Addition on the Interface Microstructure and Drop Reliability of Sn-3.5Ag Solder on Cu pads Jee, Young-Kun; Ko, Yong-Ho; Sohn, Yoon-Chul; Yu, Jin, ELECTRONIC MATERIALS LETTERS, v.2, no.3, pp.161 - 166, 2006-12 |
| Morphological transition of interfacial Ni3Sn4 grains at the Sn-3.5Ag/Ni joint Kim, JH; Jeong, SW; Kim, HD; Lee, HyuckMo, JOURNAL OF ELECTRONIC MATERIALS, v.32, no.11, pp.1228 - 1234, 2003-11 |
| Reliable single-phase micro-joints with high melting point for 3D TSV chip stacking Tian, Ye; Fang, Heng; Ren, Ning; Zhao, Yatao; Chen, Boli; Wu, Fengshun; Paik, Kyung-Wook, JOURNAL OF ALLOYS AND COMPOUNDS, v.828, 2020-07 |
| Shear strength of Sn-3.5Ag solder bumps formed on Ni/Au and organic solderability preservative surface-finished bond pads after multiple reflow steps Lee, JS; Chu, KM; Jeon, DukYoung, JOURNAL OF MATERIALS RESEARCH, v.20, no.11, pp.3088 - 3093, 2005-11 |
| Solid-state reactions and stress evolutions between SnAg and Ni(P) thin films Song, Jae Yong; Yu, Jin, JOURNAL OF MATERIALS RESEARCH, v.24, no.2, pp.482 - 486, 2009-02 |
| (UBM)Under bump metallurgy study for Pb-free bumping Jang, SY; Wolf, J; Gloor, H; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.31, no.5, pp.478 - 487, 2002-05 |
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