Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Subject INTERDIFFUSION
Showing results 1 to 9 of 9
| A study of the oxidation behavior and the postannealing effect in a graded SiGe/Si heterostructure Lim, YS; Jeong, JS; Lee, JeongYong; Kim, HS; Shon, HK; Kim, HK; Moon, DW, JOURNAL OF ELECTRONIC MATERIALS, v.31, no.5, pp.529 - 534, 2002-05 |
| COMPOSITIONAL DISORDERING IN AL0.3GA0.7AS/GAAS SUPERLATTICES BY THERMAL-TREATMENT KIM, SK; KANG, TW; HONG, CY; KIM, TW; Lee, JeongYong, PHYSICA STATUS SOLIDI A-APPLIED RESEARCH, v.143, no.1, pp.23 - 27, 1994-05 |
| Grain-boundary migration and dielectric properties of semiconducting SrTiO3 in the SrTiO3-BaTiO3-CaTiO3 system Kim, JS; Kang, Suk-Joong L, JOURNAL OF THE AMERICAN CERAMIC SOCIETY, v.82, no.5, pp.1196 - 1200, 1999-05 |
| Indirect Evaluation of the Long-Term Oxidation Properties of Al-21Ti-23Cr and Al-37Ti-12Cr Coating Materials for TIAl Alloy Lee, Jae Kyeong; Kim, SH; Wee, Dang-Moon; Kumar, KS; Oh, MH, METALS AND MATERIALS INTERNATIONAL, v.14, no.6, pp.713 - 720, 2008-12 |
| Lateral indium-indium pair correlations within the wetting layers of buried InAs/GaAs quantum dots Shin, Byungha; Lita, B; Goldman, RS; Phillips, JD; Bhattacharya, PK, APPLIED PHYSICS LETTERS, v.81, no.8, pp.1423 - 1425, 2002-08 |
| Mechanisms of lateral ordering of InAs/GaAs quantum dot superlattices Chen, W; Shin, B; Goldman, RS; Stiff, A; Bhattacharya, PK, JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, v.21, no.4, pp.1920 - 1923, 2003 |
| MICROSTRUCTURAL DEGRADATION DURING ZN DIFFUSION IN A GAINASP/INP HETEROSTRUCTURE - LAYER MIXING, MISFIT DISLOCATION GENERATION, AND ZN3P2 PRECIPITATION Park, HyoHoon; LEE, KH; Lee, JeongYong; LEE, YT; LEE, EH; LEE, JY; HONG, SK; et al, JOURNAL OF APPLIED PHYSICS, v.72, no.9, pp.4063 - 4072, 1992-11 |
| Strain-induced diffusion in a strained Si1-xGex/Si heterostructure Lim, YS; Lee, JeongYong; Kim, HS; Moon, DW, APPLIED PHYSICS LETTERS, v.77, no.25, pp.4157 - 4159, 2000-12 |
| The In-Situ TEM Isothermal Aging Evolution in a μ-Cu/NiAu/Sn/Cu Solder Joint for Full Intermetallic Compounds Interconnects of Flexible Electronics Liu, Jinhong; Jing, Xinyi; Chen, Jieshi; Paik, Kyung-Wook; He, Peng; Zhang, Shuye, ELECTRONIC MATERIALS LETTERS, v.20, no.3, pp.352 - 361, 2024-05 |
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