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Showing results 1 to 3 of 3

1
Effects of Temperature and Operation Parameters on the Galvanic Corrosion of Cu Coupled to Au in Organic Solderability Preservatives Process

Oh, Se-Kwon; Kim, YoungJun; Jung, Ki Min; Kim, Jongsoo; Shon, MinYoung; Kwon, HyukSang, METALS AND MATERIALS INTERNATIONAL, v.23, no.2, pp.290 - 297, 2017-03

2
Effects of Temperature and Operation Parameters on the Galvanic Corrosion of Cu Coupled to Au in Organic Solderability Preservatives Process

Oh, Se-Kwon; Kim, YoungJun; Jung, Ki Min; Kim, Jongsoo; Shon, MinYoung; Kwon, HyukSang, METALS AND MATERIALS INTERNATIONAL, v.23, no.2, pp.290 - 297, 2017-03

3
Investigation of Sn Whisker Growth in Electroplated Sn and Sn-Ag as a Function of Plating Variables and Storage Conditions

Chang, Jaewon; Kang, Sung K.; Lee, Jae-Ho; Kim, Keun-Soo; Lee, Hyuck Mo, JOURNAL OF ELECTRONIC MATERIALS, v.43, no.1, pp.259 - 269, 2014-01

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