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Low-Temperature Bonding of PZT (PbZrTiO3) and Flexible Printed Circuits Using Sn52In Solder Anisotropic Conductive Films for Flexible Ultrasonic Transducers Park, Jae-Hyeong; Park, Jong Cheol; Shin, SangMyung; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.11, pp.2152 - 2159, 2019-11 |
표면활성화 접합에 의한 Cu-Ni 정밀층상 복합소재의 제조공정 및 접합특성 = Fabrication process and bonding properties of Cu-Ni fine clad materials prepared by surface activation bonding (SAB)link 김경훈; Kim, Kyung-Hoon; et al, 한국과학기술원, 2010 |
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