표면활성화 접합에 의한 Cu-Ni 정밀층상 복합소재의 제조공정 및 접합특성Fabrication process and bonding properties of Cu-Ni fine clad materials prepared by surface activation bonding (SAB)
- Advisors
- 홍순형researcher; Hong, Soon-Hyungresearcher
- Description
- 한국과학기술원 : 신소재공학과,
- Publisher
- 한국과학기술원
- Issue Date
- 2010
- Identifier
- 455397/325007 / 020055808
- Language
- kor
- Description
학위논문(박사) - 한국과학기술원 : 신소재공학과, 2010.08, [ xi, 166 p. ]
- Keywords
계면; 접합; 활성화; 표면; 정밀층상; Fine Clad; Interface; Bonding; Activation; Surface
- Appears in Collection
- MS-Theses_Ph.D.(박사논문)
- Files in This Item
- There are no files associated with this item.
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