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Showing results 1 to 6 of 6

1
A Study on Polyvinylidene Difluoride (PVDF) Anchoring Polymer Layer (APL) Solder Anisotropic Conductive Films (ACFs) for Fine-Pitch Flex-on-Flex (FOF) Interconnection

Song, Lu; Yoon, Dal-Jin; Zhang, Shuye; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.10, no.3, pp.368 - 377, 2020-03

2
A study on the Anchoring Polymer Layer (APL) Anisotropic Conductive Films (ACFs) with self-exposed conductive particles surface for ultra-fine pitch Chip-on-Glass (COG) applications

Yoon, Dal-Jin; Paik, Kyung-Wook, 69th IEEE Electronic Components and Technology Conference (ECTC), pp.2266 - 2271, IEEE, 2019-05

3
A Study on the Conductive Particle Movements in Polyvinylidene Fluoride Anchoring Polymer Layer Anisotropic Conductive Films for 20-mu m Fine-Pitch Interconnection

Lee, Sang-Hoon; Yoon, Dal-Jin; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.2, pp.209 - 215, 2019-02

4
A STUDY ON THE NOVEL ANCHORING POLYMER LAYER(APL) ANISOTROPIC CONDUCTIVE FILMS(ACFs) FOR ULTRA FINE PITCH ASSEMBLY APPLICATIONS

Paik, Kyung-Wook; Yoon, Dal-Jin, Pan Pacific Microelectronics Symposium (Pan Pacific), IEEE, 2018-02

5
ACF bonding technology for paper- and PET-based disposable flexible hybrid electronics

Yoon, Dal-Jin; Malik, Muhammad-Hassan; Yan, Pan; Paik, Kyung-Wook; Roshanghias, Ali, JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.32, no.2, pp.2283 - 2292, 2021-01

6
Bending Properties of Fine Pitch Flexible CIF (Chip-in-Flex) Packages using APL (Anchoring Polymer Later) ACFs (Anisotropic Conductive Films)

Kim, Ji-Hye; Yoon, Dal-Jin; Paik, Kyung-Wook, 69th IEEE Electronic Components and Technology Conference (ECTC), pp.2272 - 2277, IEEE, 2019-05

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