A Study on Polyvinylidene Difluoride (PVDF) Anchoring Polymer Layer (APL) Solder Anisotropic Conductive Films (ACFs) for Fine-Pitch Flex-on-Flex (FOF) Interconnection

Cited 0 time in webofscience Cited 0 time in scopus
  • Hit : 190
  • Download : 0
Fine-pitch flex-on-flex (FOF) assembly has been introduced for various electronic packaging applications because electronic products require higher functionality, flexibility, and I/O density. In this article, novel polyvinylidene difluoride (PVDF) anchoring polymer layer (APL) solder anisotropic conductive films (ACFs) were investigated for fine-pitch FOF applications. The capture rates of conductive particles and the insulation rates between neighboring electrodes have been significantly enhanced using PVDF APL solder ACFs as a result of suppressing the movement of conductive particles by the high tensile strength of the PVDF APL layer. For good solder wetting on electrodes, flux activators were added into the PVDF APL layer to remove the solder oxide layer. However, the tensile strength of the PVDF layer decreased as the flux activator content in the APL increased. The capture rates of conductive particles decreased as more flux activators were added because of the lower tensile strength of PVDF. Furthermore, optimized flux activator content in ACFs with 0.5 wt% in the APL and 2-wt% flux activators were also added in non- conductive films (NCFs) to obtain good solder wetting. Using the optimized APL solder ACFs, excellent contact resistances and insulation resistances were obtained before and after a pressure cooker test (PCT) and 85 degrees C/85% relative humidity (RH) reliability tests. As a conclusion, the PVDF APL solder ACF assembly can provide an excellent interconnect solution for fine-pitch FOF assemblies used for portable electronic product applications.
Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Issue Date
2020-03
Language
English
Article Type
Article
Citation

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.10, no.3, pp.368 - 377

ISSN
2156-3950
DOI
10.1109/TCPMT.2020.2972556
URI
http://hdl.handle.net/10203/273874
Appears in Collection
MS-Journal Papers(저널논문)
Files in This Item
There are no files associated with this item.

qr_code

  • mendeley

    citeulike


rss_1.0 rss_2.0 atom_1.0