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1
A study on the Anchoring Polymer Layer(APL) Solder Anisotropic Conductive Films (ACFs) for Ultra Fine Pitch Flex-on-Flex (FOF) assembly using an Ultrasonic bonding method

Yoon, Dal Jin; Lee, Sang-Hoon; Paik, Kyung-Wook, 68th IEEE Electronic Components and Technology Conference (ECTC), pp.15 - 20, IEEE-CPMT, 2018-05-30

2
A Study on the Magnetic Dispersion of the Conductive Particles of Anchoring-Polymer-Layer Anisotropic Conductive Films and Its Fine-Pitch Interconnection Properties

Byeon, Jun-Ho; Yoon, Dal Jin; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.7, pp.1235 - 1243, 2019-07

3
A study on the novel Nylon Anchoring Polymer Layer(APL) Anisotropic Conductive Films(ACFs) for Ultra Fine pitch Chip-on-Glass(COG) applications

Yoon, Dal Jin; Lee, Sang-Hoon; Paik, Kyung-Wook, IEEE 67th Electronic Components and Technology Conference (ECTC), pp.1113 - 1118, IEEE-CPMT, 2017-05-31

4
(A) study on the novel nylon anchoring polymr layer(APL) anisotropic conductive films(ACFs) fir ultra fine pitch chip-on-glass applications = 극 미세 피치 Chip-on-Glass 어플리케이션을 위한 나일론 고정용 폴리머 층을 지닌 이방성 전도 필름에 대한 연구link

Yoon, Dal Jin; 윤달진; et al, 한국과학기술원, 2016

5
Effects of Anisotropic Conductive Films (ACFs) Gap Heights on the Bending Reliability of Chip-in-Flex (CIF) Packages for Wearable Electronics Applications

Kim, Jihye; Lee, Tae-Ik; Yoon, Dal Jin; Kim, Taek-Soo; Paik, Kyung-Wook, IEEE 67th Electronic Components and Technology Conference (ECTC), pp.2161 - 2167, IEEE-CPMT, 2017-06-01

6
Effects of Polyacrylonitrile Anchoring Polymer Layer Solder Anisotropic Conductive Films on the Solder Ball Movement for Fine-Pitch Flex-on-Flex (FOF) Assembly

Yoon, Dal Jin; Lee, Sang-Hoon; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.9, no.5, pp.830 - 835, 2019-05

7
Effects of the anchoring polymer layer (APL) material properties and surface modification of conductive particles on the ultra-fine pitch chip-on-glass (COG) interconnection = 고정용 폴리머 층의 재료 특성과 도전입자의 표면 개질이 극 미세피치 Chip-on-Glass 접속에 미치는 영향에 관한 연구link

Yoon, Dal Jin; Paik, Kyoung-Wook; et al, 한국과학기술원, 2020

8
Effects of the Anchoring Polymer Layer (APL) Materials on Conductive Particle Movements for Ultra-Fine Pitch Chip-on-Glass (COG) Interconnection

Yoon, Dal Jin; Paik, Kyung-Wook, SID Symposium, Seminar, and Exhibition 2018, Display Week 2018, pp.1113 - 1116, John Wiley and Sons Inc, 2018-05

9
Effects of the Nylon Anchoring Polymer Layer on the Conductive Particle Movements of Anisotropic Conductive Films for Ultrafine Pitch Chip-on-Glass Applications

Yoon, Dal Jin; Lee, Sang-Hoon; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.8, no.10, pp.1723 - 1728, 2018-10

10
Self-exposure method for surface of conductive particles anchored in polymer layer, method of fabricating anisotropic conductive film using the self-exposure method and the anisotropic conductive film

Paik, Kyung-Wook; Yoon, Dal Jin

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