Electronic packaging technology has become very important in electronic devices, because electrical interconnection problems such as high contact resistance and short-circuit failure have become serious issues in ultrafine pitch interconnection. In this paper, a nylon anchoring polymer layer (APL) structure has been introduced into the anisotropic conductive films (ACFs) system. Then, the effects of nylon APL properties on conductive particle movement of ACFs and its interconnection stability for ultrafine pitch chip-on-glass (COG) applications were investigated. The APL structure can significantly suppress the particles' movement for ultrafine pitch COG applications, and prevent the short-circuit problem between neighboring electrodes. After ACFs bonding process, the conductive particles capture rate of the conventional ACFs was 33%; however, that of the nylon APL ACFs showed 90%. In addition, the nylon APL ACFs showed excellent electrical interconnection properties such as stable contact resistances without any open or short-circuit failures. As a result, the nylon APL ACFs can be used as new interconnection materials for ultrafine pitch interconnection applications.