Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Author Chung, Chang-Kyu
Showing results 1 to 17 of 17
| A Study on the Curing properties and Viscosities of Non-Conductive Films (NCFs) for Sn-Ag Solder Bump Flip Chip Assembly Lee, Hanmin; Lee, Seyong; Park, Jong-Ho; Chung, Chang-Kyu; Jang, Kyung-Woon; Kim, Il; Choi, SeongWoo; et al, 68th IEEE Electronic Components and Technology Conference (ECTC), pp.2464 - 2469, IEEE-CPMT, 2018-06-01 |
| A study on the effects of anisotropic conductive film (ACF) properties on interconnection stability of ACF flip-chip assemblies = 이방성 전도성 필름 특성이 플립칩 어셈블리의 접속 안정성에 끼치는 영향에 대한 연구link Chung, Chang-Kyu; 정창규; et al, 한국과학기술원, 2010 |
| Effect of Proton Irradiation on the Magnetic Properties of Antiferromagnet/ferromagnet Structures Kim, Dong-Jun; Park, Jin-Seok; Ryu, Ho Jin; Jeong, Jong-Ryul; Chung, Chang-Kyu; Park, Byong-Guk, JOURNAL OF MAGNETICS, v.21, no.2, pp.159 - 163, 2016-06 |
| Effects of Conductive Particles on the Electrical Stability and Reliability of Anisotropic Conductive Film Chip-On-Board Interconnections Chung, Chang-Kyu; Sim, Gidong; Lee, Soon-Bok; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.2, no.3, pp.359 - 366, 2012-03 |
| Effects of Nanofiber on the Electrical Properties of Anisotropic Conductive Adhesives (ACAs) Suk, Kyoung-Lim; Chung, Chang-Kyu; Paik, Kyung-Wook, JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, v.13, no.1, pp.351 - 355, 2013-01 |
| Effects of the Degree of Cure on the Electrical and Mechanical Behavior of Anisotropic Conductive Films Chung, Chang-Kyu; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.39, pp.410 - 418, 2010-04 |
| Effects of the functional groups of non-conductive films(NCFs) on materials properties and reliability of NCFs flip-chip-on-organic boards = 플립칩 접속을 위한 비전도성 필름의 관능기가 물질특성 및 신뢰성에 미치는 영향link Chung, Chang-Kyu; 정창규; et al, 한국과학기술원, 2006 |
| Effects of the functional groups of nonconductive films (NCFs) on material properties and reliability of NCF flip-chip-on-organic boards Chung, Chang-Kyu; Kwon, Woon-Seong; Jang, Kyung-Woon; Park, Jin-Flyoung; Lee, Soon-Bok; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.30, no.3, pp.464 - 471, 2007 |
| Effects of thermal cycling on material properties of nonconductive pastes (NCPs) and the relationship between material properties and warpage behavior during thermal cycling Jang, Kyung-Woon; Kim, Hyoung-Joon; Chung, Chang-Kyu; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.31, no.3, pp.559 - 565, 2008-09 |
| Enhancement of electrical stability of anisotropic conductive film (ACF) interconnections with viscosity-controlled and high T-g ACFs in fine-pitch chip-on-glass applications Chung, Chang-Kyu; Kim, Jae-Han; Lee, Jong-Won; Seo, Kyoung-Won; Paik, Kyung-Wook, MICROELECTRONICS RELIABILITY, v.52, no.1, pp.217 - 224, 2012-01 |
| Flexible Chip-on-Flex (COF) and embedded Chip-in-Flex (CIF) packages by applying wafer level package (WLP) technology using anisotropic conductive films (ACFs) Suk, Kyoung-Lim; Son, Ho-Young; Chung, Chang-Kyu; Kim, Joong-Do; Lee, Jin-Woo; Paik, Kyung-Wook, MICROELECTRONICS RELIABILITY, v.52, no.1, pp.225 - 234, 2012-01 |
| Moisture induced interface weakening in ACF package Sim, Gidong; Chung, Chang-Kyu; Paik, Kyung-Wook; Lee, Soon-Bok, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.528, no.2, pp.698 - 705, 2010-12 |
| Nonconductive Films (NCFs) With Multifunctional Epoxies and Silica Fillers for Reliable NCFs Flip Chip on Organic Boards (FCOBs) Chung, Chang-Kyu; Paik, Kyung-Wook, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.32, no.2, pp.65 - 73, 2009-04 |
| Novel Wafer Level Packages Using Anisotropic Conductive Pastes (ACPs) and NCPs Paik, Kyung-Wook; Kim, Il; Son, Ho-Young; Chung, Chang-Kyu, Novel Wafer Level Packages Using Anisotropic Conductive Pastes (ACPs) and NCPs, pp.0 - 0, 2008 |
| Study of the formation of bubbles in rigid substrate-flexible substrate bonding using anisotropic conductive films and the bubble effects on anisotropic conductive film joint reliability Kim, Hyoung-Joon; Chung, Chang-Kyu; Kwon, Yong-Min; Yim, Myung-Jin; Hong, Soon-Min; Jang, Se-Young; Moon, Young-Joon; et al, JOURNAL OF ELECTRONIC MATERIALS, v.36, pp.56 - 64, 2007-01 |
| Theoretical prediction and experimental measurement of the degree of cure of anisotropic conductive films (ACFs) for chip-on-flex (COF) applications Chung, Chang-Kyu; Kwon, Yong-Min; Kim, Il; Son, Ho-Young; Choo, Kyo-Sung; Kim, Sung-Jin; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.37, no.10, pp.1580 - 1590, 2008-10 |
| Wafer Level Package Using Pre-Applied Anisotropic Conductive Films(ACFs) Son, Ho-Young; Chung, Chang-Kyu; Paik, Kyung-Wook, 2007 Pan Pacific Microelectronics Symposium & Tabletop Exhibition, pp.0 - 0, 2007-01 |
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