Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Author Choi, Yong-Won
Showing results 1 to 17 of 17
| A Novel Double Layer NCF for Highly Reliable Micro-Bump Interconnection Shin, Ji-Won; Choi, Yong-Won; Kim, Young Soon; Kang, Un Byung; Seo, Sun Kyung; Paik, Kyung-Wook, The 64th Electronic Components and Technology Conference, The 64th Electronic Components and Technology Conference, 2014-05-28 |
| A Novel Fine Pitch TSV Interconnection Method Using NCF with Zn Nano -particles Shin, Ji-Won; Choi, Yong-Won; Kim, Young Soon; Kang, Un Byung; Seo, Sun Kyung; Paik, Kyung-Wook, The 64th Electronic Components and Technology Conference, The 64th Electronic Components and Technology Conference, 2014-05-28 |
| A Study on the Fine Pitch Chip Interconnection Using Cu/SnAg Bumps and B-stage Non-conductive Films (NCFs) for 3D-TSV Vertical Interconnection Choi, Yong-Won; Shin, Ji-Won; Kim, Young Soon; Suk, Kyung-lim; Kim, Il; Paik, Kyung-Wook, The 64th Electronic Components and Technology Conference, The 64th Electronic Components and Technology Conference, 2014-05-28 |
| A study on the interconnection properties of 3D TSV chip using non-conductive films(NCFs) with thermal acid generator(TAG) = 산 발생제를 함유한 비전도성 접합필름(NCF)을 이용한 관통비아 칩의 접속특성에 대한 연구link Choi, Yong-Won; 최용원; et al, 한국과학기술원, 2014 |
| (A) study on epoxy die attach films(DAFs) for chip stacking = 칩 적층을 위한 에폭시계 Die attach films(DAFs) 에 관한 연구link Choi, Yong-Won; 최용원; et al, 한국과학기술원, 2009 |
| Analysis of 3D TSV Vertical Interconnection Using Pre-applied Nonconductive Films Choi, Yong-Won; Shin, Ji Won; Suk, Kyung-lim; Kim, Youngsoon; Kim, Il; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.43, no.11, pp.4214 - 4223, 2014-11 |
| Development of Anhydride-based NCFs for Cu/Sn-Ag Eutectic Bonding and Process Optimization for Fine Pitch TSV Chip Stacking Shin, Ji-Won; Choi, Yong-Won; Kim, Young Soon; Kang, Un Byung; Jee, Young Kun; Hwang, Ji Hwan; Paik, Kyung-Wook, The 62nd Electronic Components and Technology Conference, IEEE, 2012-05 |
| Effect of NCFs with Zn-nanoparticles on the Interfacial Reactions of 40 um Pitch Cu pillar/Sn-Ag Bump for TSV Interconnection Shin, Ji-Won; Choi, Yong-Won; Kim, Young Soon; Kim, Un Byung; Jee, Young Kun; Paik, Kyung-Wook, The 63rd Electronic Components and Technology Conference, pp.1024 - 1030, The 63rd Electronic Components and Technology Conference, 2013-05-30 |
| Effects of Pad Surface Finish on Interfacial Reliabilities of Cu-Pillar/Sn-Ag Bumps of 2.5D TSV-Enterposer on PCB Applications Kim, Young Soon; Shin, Ji-Won; Choi, Yong-Won; Paik, Kyung-Wook, The 64th Electronic Components and Technology Conference, The 64th Electronic Components and Technology Conference, 2014-05-28 |
| Effects of Thermocompression Bonding Parameters on Cu Pillar/Sn-Ag Microbump Solder Joint Morphology Using Nonconductive Films Lee, Hyeong Gi; Shin, Ji Won; Choi, Yong-Won; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.3, pp.450 - 455, 2017-03 |
| High performance encapsulant for light-emitting diodes (LEDs) by a sol-gel derived hydrogen siloxane hybrid Kim, Joon-Soo; Yang, Seung-Cheol; Kwak, Seung-Yeon; Choi, Yong-Won; Paik, Kyung-Wook; Bae, Byeong-Soo, JOURNAL OF MATERIALS CHEMISTRY, v.22, no.16, pp.7954 - 7960, 2012 |
| Non-conductive film with Zn-nanoparticles (Zn-NCF) for 40 mu m pitch Cu-pillar/Sn-Ag bump interconnection Shin, Ji Won; Kim, Il; Choi, Yong-Won; Kim, Youngsoon; Kang, Un Byung; Jee, Young Kun; Paik, Kyung-Wook, MICROELECTRONICS RELIABILITY, v.55, no.2, pp.432 - 441, 2015-02 |
| Studies on the Polymer Adhesive Wafer Bonding Method Using Photo-Patternable Materials for MEMS Motion Sensors Applications Kim, Jong-Hyun; Kim, Il; Choi, Yong-Won; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.2, no.7, pp.1118 - 1127, 2012-07 |
| The Effects of Self-Fluxing Additives in Solder Anisotropic Conductive Films (ACFs) on Solder Wettability and Joint Reliability of Flex-On-Board (FOB) Assemblies Kim, Seung-Ho; Choi, Yong-Won; Kim, Yoo-Sun; Paik, Kyung-Wook, The 64th Electronic Components and Technology Conference, The 64th Electronic Components and Technology Conference, 2014-05-31 |
| Thermally resistant UV-curable epoxy-siloxane hybrid materials for light emitting diode (LED) encapsulation Yang, Seung-Cheol; Kwak, Seung-Yeon; Jin, Jung-Ho; Kim, Joon-Soo; Choi, Yong-Won; Paik, Kyung-Wook; Bae, Byeong-Soo, JOURNAL OF MATERIALS CHEMISTRY, v.22, no.18, pp.8874 - 8880, 2012 |
| Wafer Level Packages (WLPs) using B-stage Non-conductive Films (NCFs) for Highly Reliable 3D-TSV Micro-bump Interconnection Lee, Hyeong-Gi; Choi, Yong-Won; Shin, Ji-won; Paik, Kyung-Wook, 65th Electronic Components and Technology Conference, IEEE Electronic Components and Technology Conference, 2015-05-27 |
| Wafer-Level Packages Using B-Stage Nonconductive Films for Cu Pillar/Sn-Ag Microbump Interconnection Lee, Hyeong Gi; Choi, Yong-Won; Shin, Ji Won; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.5, no.11, pp.1567 - 1572, 2015-11 |
Discover
Open Access
Date issued
- 2,045 2020 - 2024
- 6,673 2010 - 2019
- 5,356 2000 - 2009
- 3,582 1990 - 1999
- 982 1980 - 1989