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Showing results 21 to 26 of 26

21
Stresses in electroless Ni-P films for electronic packaging applications

Jeon, YD; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.25, no.1, pp.169 - 173, 2002-03

22
Studies of electroless nickel under bump metallurgy-solder interfacial reactions and their effects on flip chip solder joint reliability

Jeon, YD; Paik, Kyung-Wook; Bok, KS; Choi, WS; Cho, CL, JOURNAL OF ELECTRONIC MATERIALS, v.31, no.5, pp.520 - 528, 2002-05

23
Studies of electroless nickel under bump metallurgy—Solder interfacial reactions and their effects on flip chip solder joint reliability

Jeon, Young Doo; Paik, Kyung Wook; Bok, Kyoung Soon; Choi, Woo Suk; Cho, Chul Lae, Journal of Electronic Materials v.31 n.5, 520-528, 2000-01

24
Ultrasonic Bonding Using Anisotropic Conductive Films (ACFs) for Flip Chip Interconnection

Lee, Ki-Won; Kim, Hyoung-Joon; Yim, Myung-Jin; Paik, Kyung-Wook, IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, v.32, no.4, pp.241 - 247, 2009-10

25
인듐 범프를 이용한 VCSEL 어레이의 플립칩 본딩 최적화 = Optimization of flip chip bonding for a VCSEL array using indium bumpslink

주건모; Chu, Kun-Mo; et al, 한국과학기술원, 2003

26
전해도금에 의한 미세 공정 Sn-Bi 솔더 범프 제작에 관한 연구 = Fabrication of small eutectic Sn-Bi solder bumps by electroplatinglink

정회록; Jung, Hoe-Rok; et al, 한국과학기술원, 2003

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