Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Author Kim, JY
Showing results 40 to 49 of 49
| Soft materials nanoengineering by directed molecular assembly Jeong, SJ; Kim, JY; Moon, HS; Kim, Sang Ouk, 2010 10th IEEE Conference on Nanotechnology, NANO 2010, pp.41 - 45, IEEE, 2010-08-17 |
| Structurally Nanocrystalline-Electrically Single Crystalline ZnO-Reduced Graphene Oxide Composites Nam, Woo Hyun; Kim, Bo Bae; Seo, Seul Gi; Lim, Young Soo; Kim, JY; Seo, Won-Seon; Choi, Won Kook; et al, NANO LETTERS, v.14, no.9, pp.5104 - 5109, 2014-09 |
| Superconducting properties of well-shaped MgB2 single crystals Kim, KHP; Choi, JH; Jung, CU; Chowdhury, P; Lee, HS; Park, MS; Kim, HJ; et al, PHYSICAL REVIEW B, v.65, no.10, 2002-03 |
| Surface modification and low voltage cathodoluminescence of SrTiO3:Pr, Al, Ga phospohr Jeon, Duk Young; Kang, JH; Kim, JY; Bukesov, SA, 2004 International Display Workshops, pp.1119 - 1122, 2004 |
| Synthesis and characterization of orange-emitting SnO2 : Eu3+ phosphor by an optimized combustion method Kang, JH; Kim, JY; Jeon, DukYoung, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.152, no.3, pp.33 - 38, 2005 |
| The effect of addition of Gd, La into YVO4:Eu3+ red phosphor Jeon, Duk Young; Kang, JH; Im, WB; Lee, DC; Kim, JY, 2003 International Meeting on Information Display, pp.1017 - 1020, 2003 |
| The effects of electroplating parameters on the composition and morphology of Sn-Ag solder Kim, JY; Yu, Jin; Lee, JH; Lee, TY, JOURNAL OF ELECTRONIC MATERIALS, v.33, no.12, pp.1459 - 1464, 2004-12 |
| The effects of surface treatment for ZnS : Ag,Cl using a combination of stirring and ultrasonication in KOH solutions Lee, DC; Bukesov, SA; Lee, S; Kang, JH; Jeon, DukYoung; Park, DH; Kim, JY, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.151, no.11, pp.227 - 231, 2004 |
| The effects of surface treatment using stirring & ultrasonication in KOH solutions for blue phosphor ZnS:Ag,Cl Jeon, Duk Young; Lee, DC; Park, DH; Lee, S; Kim, JY, 2003 International Display Manufacturing Conference & FPD expo, pp.703 - 706, 2003 |
| Thermo-Mechanical Reliability of the Benzocyclobutane(BCB) film in a WLCSP Process Yu, Jin; Lee, KO; Kim, JY; Park, IS, Proc.3rd Electronic Materials and Packaging, pp.84 - 87, 2001 |
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