Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Author Paik, Kyung Wook
Showing results 11 to 15 of 15
| Studies of electroless nickel under bump metallurgy—Solder interfacial reactions and their effects on flip chip solder joint reliability Jeon, Young Doo; Paik, Kyung Wook; Bok, Kyoung Soon; Choi, Woo Suk; Cho, Chul Lae, Journal of Electronic Materials v.31 n.5, 520-528, 2000-01 |
| Study on Bending Feasibility and Joint Reliability for Fine Pitch Flex-on-Flex (FOF) Assembly using Nanofiber Solder Anisotropic Conductive Films (ACFs) and Ultrasonic (US) Bonding Kim, Tae Wan; Lee, Tae Ik; Lee, Sang Hoon; Kim, Taek Soo; Paik, Kyung Wook, The 14th International Symposium on Microelectronics and Packaging, The Korean Microelectronics and Packaging Society, 2015-10-14 |
| The Effect of Anisotropic Conductive Films Adhesion on the Bending Reliability of Chip-in-Flex Packages for Wearable Electronics Applications Kim, Ji Hye; Lee, Tae Ik; Kim, Taek Soo; Paik, Kyung Wook, 66th Electronic Components and Technology Conference, pp.1583 - 1591, Electronic Components and Technology Conference, 2016-06-01 |
| Thermo-compression bonding using Non-Conductive Films (NCFs) for 3-D TSV Micro-bump Interconnection Lee. Hyeong Gi; Lee, Se Yong; Choi, Yong Won; Paik, Kyung Wook, IEEE 66th Electronic Components and Technology Conference, pp.1809 - 1815, IEEE 66th Electronic Components and Technology Conference, 2016-06-01 |
| Ultra-Thin Chip-in-Flex (CIF) technology using Anisotropic Conductive Films (ACFs) for Wearable Electronics Applications Kim, Ji Hye; Lee, Tae-Ik; Shin, Ji Won; Kim, Taek-Soo; Paik, Kyung Wook, The 14th International Symposium on Microelectronics and Packaging, The Korean Microelectronics and Packaging Society, 2015-10-15 |
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