Showing results 10 to 12 of 12
Polyimide 위에 스퍼터 증착한 Cu 및 Cr 박막의 잔류응력에 관한 연구 = A study on the residual stress of sputter-deposited Cu and Cr thin films on polyimidelink 조성일; Cho, Sung-Il; et al, 한국과학기술원, 2001 |
Residual stress and interfacial reaction of the electroplated Ni-Cu alloy under bump metallurgy in the flip-chip solder joint Kim, SH; Kim, JY; Yu, Jin; Lee, TY, JOURNAL OF ELECTRONIC MATERIALS, v.33, no.9, pp.948 - 957, 2004-09 |
반응성 스퍼터링법에 의한 $Pb(Zr,Ti)O_3$ 압전 박막의 제조 및 특성평가 = Preparation and characterization of $Pb(Zr,Ti)O_3$ piezoelectric thin films by reactive sputteringlink 김혁환; Kim, Hyuk-Hwan; et al, 한국과학기술원, 2001 |
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