Showing results 6 to 8 of 8
New Sn-0.7Cu-based solder alloys with minor alloying additions of Pd, Cr and Ca Koo, Jahyun; Chang, Jaewon; Lee, Young Woo; Hong, Sung Jea; Kim, Keun-Soo; Lee, Hyuck Mo, JOURNAL OF ALLOYS AND COMPOUNDS, v.608, pp.126 - 132, 2014-09 |
Plastic Deformation Effect on Sn Whisker Growth in Electroplated Sn and Sn-Ag Solders Kang, Sung-Kwon; Chang, Jaewon; Lee, Hyuck Mo; Lee, Jae-Ho; Kim, Keun-Soo, The 63rd Electronic Components and Technology Conference (ECTC 2013), pp.1018 - 1023, IEEE Components, Packaging, and Manufacturing Technology (CPMT) Society, 2013-05-30 |
Recrystallization as a Growth Mechanism for Whiskers on Plastically Deformed Sn Films Chang, Jaewon; Kang, Sung K.; Lee, Jae-Ho; Kim, Keun-Soo; Lee, Hyuck Mo, JOURNAL OF ELECTRONIC MATERIALS, v.44, no.10, pp.3486 - 3499, 2015-10 |
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